RSS
Home
-
Synopsys extends AI-driven full-stack EDA suite
The software is geared toward every stage of semiconductor development.
-
TDK unveils haptic feedback development kit
It offers engineers first impressions of piezo actuators.
-
Emerson to showcase Floor to Cloud packaging solutions at PACK EXPO 2023
Discover how Floor to Cloud solutions empower smarter packaging lines and more efficient processes that make it possible for manufacturers to continuously improve plant productivity, sustainability and safety.
-
VPT releases SVLFL5000 series of space-qualified DC-DC converters
VPT, Inc., a HEICO company, has announced the availability of its SVLFL5000 series of space-qualified DC-DC converters.
-
MSM II: The new generation of mechanical pushbuttons made of high-grade stainless steel
The new microswitch provides a shallower mounting depth for switching currents from 100 mA to 3 A for single pole double throw and double pole double throw circuits.
-
Intel to provide 300 mm foundry services to Tower
The agreement continues the saga between the two companies.
-
New dynamometer line geared for testing electric motor efficiency
The new models can test a wide range of motor sizes in accordance with a variety of national and international standards.
-
Swisscom to launch IoT solution for enterprises
Based on Enea’s technology, it will allow companies with a smaller number of devices to access APNs.
-
Agile Analog joins TSMC’s IP alliance
TSMC’s customers can now use the IP for security, power management and more.
-
DigiKey and Amazon distributing near-field flash lidar
PreAct’s Mojave sensor works with non-automotive applications.
-
Precision Optical Transceivers rebrands to Precision Optical Technologies
The rebrand reflects the company's continued global growth and product expansion to end-to-end optical networking solutions.
-
Rohde & Schwarz and Greenerwave collaborate to verify RIS modules and drive 6G research
This is one of the first real measurements confirming that a metamaterial-based reconfigurable intelligent surface (RIS) can improve the coverage and efficiency of wireless communications performance, especially for 5G FR2.
-
New IO-Link Master reduces hardware costs, future-proofs pneumatic valve systems with IIoT integration
Users can reduce costs by including multiple IO-Link masters on one G3 Fieldbus platform.
-
Optical beam steering chips may be the future of lidar
Startup Lumotive has started full production of what it calls the first LCM semiconductor.
-
5G RedCap: The gateway to enhanced IoT and wearables
A deep look at the technology driving new solutions for 5G.
-
Philips Hue expands into smart home security
Signify’s smart lighting now can incorporate smart cameras and smart sensors for home protection.
-
TDK begins ToF sensor production
The sensors work in robotics, smart home and mobile devices.
-
Innodisk introduces the first PCIe nanoSSD 4TE3 with compact size, reliability and performance
The PCIe 4.0 x4 ball grid array solid-state drive (SSD) featuring compact size, enhanced performance and reliability to unlock the potential for 5G, automotive and aerospace applications.
-
Vishay Intertechnology miniaturized IR sensor modules feature modulated carrier output for code learning applications
The devices provide pin to pin replacements for previous-generation solutions while offering 50% lower power consumption and improved performance.
-
Video: Huawei launches new flagship smartphone
The handset can receive and make satellite calls and texts.
