Intel Corp. has offered a look into its advanced packaging technologies as part of its Intel Foundry Services (IFS) manufacturing technology.
Intel has developed packaging such as embedded multi-die interconnect bridge (EMIB), which allows multiple chips on a package to be connected side by side, and Foveros, chips are stacked on top of one another in a 3D fashion.
“As Moore's Law has been progressing, traditional scaling has been slowing down,” said Ann Kelleher, executive VP and GM of Intel’s technology development. “But as we start doing advanced packaging and heterogeneous integration, it means we can pack a lot more components into a given package and a given product.”
In the video, Intel describes the process of developing advanced packaging but also why they are important in the overall scheme of electronics and printed circuit boards. It also gives a preview into the Data Center GPU Max Series, an AI device that has 47 different chiplets made on five different process nodes and features both the EMID and Foveros packaging tech.
