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More speed, more scaling with Rittal and Eplan: How the industry is securing its competitiveness
Discover how the intelligent interaction of software, hardware and automation enable products to be developed faster, produced more cost-effectively and bring significant added value.
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TE Connectivity launches 56G MezzaWave connectors and cable assemblies
Built to support data rates up to 56 Gbps PAM4 in high-density environments, these products help enable high-performance connectivity and exceptional signal integrity for advanced systems.
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Advanced Chip and Circuit Materials introduces negative and near-zero CTE materials to eliminate thermomechanical constraints for large-format AI chips
These dielectric materials address thermomechanical mismatch problems encountered while scaling large-scale chips for artificial intelligence (AI) circuits.
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The unglamorous layer beneath fab cleanrooms is getting its first research lab
ISRL USA and AI Infrastructure Partners are partnering to build the industry's first dedicated subfab R&D facility.
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Bosch bets big on SiC as market turmoil creates opening
With Wolfspeed's bankruptcy and Chinese competition upending the SiC market, Bosch eyes leadership in the wide bandgap sector.
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Redox flow battery performance peaks with titanium
Based on titanium ions as the redox-active material and molten salt as electrolyte, this battery provides higher charge-discharge current density compared to conventional vanadium redox flow battery designs.
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Advantest joins Applied Materials EPIC platform
The collaboration will strengthen the ecosystem between front-end manufacturing and back-end testing of chips.
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Anderson Power data center product team to showcase Saf-D-Grid at 2026 Open Compute Summit
The latest advancements in the Saf-D-Grid Connector series, engineered for maximum power in minimal space, will be on display.
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Rohde & Schwarz joins FormFactor’s MeasureOne partner program
The partnership focuses on on-wafer radio frequency (RF) component characterization.
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Autonomous “Alfie” humanoid robot built for advanced industrial operations
The new robot, dubbed Autonomous Alfie, reportedly brings automation to manufacturing processes that tend to require a delicate touch.
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International Manufacturing Services exhibits at the Components for Military & Space Electronics Conference and Exhibition
The company will highlight advanced resistive and attenuation solutions engineered for mission-critical military and space platforms operating in extreme thermal and electrical environments.
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TDK announces third-generation 1,500 W wide-range AC-DC power modules
The series accepts a wide 85 V AC to 305 V AC input range, enabling operation on a 277 V AC nominal input to power industrial, lighting and building automation equipment.
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Data centers and the new recycling economy
As more hyperscale AI facilities are constructed, a hardware turnover and recycling surge is accelerating.
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SECO’s Clea framework selected by Hitachi Energy for multiyear rollout to support secure, scalable energy digitalization
Hitachi will integrate the SECO Clea framework into its Energy Connect platform.
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Altech 60 A IEC 60309-II pin and sleeve devices combine security and safety
These products ensure safety, reliability and continuous uptime and comply with UL 1682.
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Phoenix Contact at Hannover Messe: It’s all about comprehensive, networked energy systems
At this year’s trade fair, Phoenix Contact is focusing on four topics: Power reliability, safe automation, efficient control cabinet building and integrated connection technology.
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Ant-inspired robots collaborate to build and excavate
Taking inspiration from ants who collectively build vast, intricate, climate-controlled structures, the team has reportedly built this fleet of cooperative robots that can spontaneously organize to build and dismantle structures, guided only by environmental cues and minimal physical rules.
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ECIA: Best sales environment for electronic components in 5 years
And it will continue into April.
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Taoglas to showcase antenna innovation and host GNSS Masterclass at EuCAP 2026
Taoglas will underline the increasing complexity of antenna integration in electronic systems, where performance depends on interactions between the antenna, PCB, enclosure and multi-radio environment.
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TechInsights Teardown: Samsung’s The Premiere 5 Projector
A partial deep dive into the interaction projector.
