Connectivity and sensors specialist TE Connectivity has launched its 56G MezzaWave connectors and cable assemblies, which help power demanding applications including edge artificial intelligence (AI), data centers, industrial automation, robotics, and aerospace and defense.
Source: TE Connectivity
Engineered to deliver notable signal integrity, TE’s high-speed, high-density 56G MezzaWave connector family is built on an open-pin-field array platform that supports data rates up to 56 Gbps PAM4 for next-generation modular systems.
The series provides design flexibility with a 1.27 mm pitch option, pin counts ranging from 80 mm to 560 mm, and 7 mm to 10 mm stack heights. It also features drop-in compatibility, enabling the direct replacement of existing components without redesign.
By combining advanced ball grid array (BGA) technology with a ruggedized mechanical design, MezzaWave connectors reliably support high-speed data transmission and are rated for up to 1,000 mating cycles and a wide operating temperature range from -55º C to 125º C. These connectors meet VMEbus International Trade Association (VITA) and American National Standards Institute (ANSI) standards and provide superior routing and grounding flexibility for optimized system performance.
“As data rates continue to accelerate, customers need interconnect solutions that can deliver performance and reliability,” commented TE Connectivity product manager Quinnie Lu. “Our 56G MezzaWave connectors and cable assemblies offer multiple configuration options to help meet their system requirements and the modularity to allow for seamless upgrades.”
Key benefits include:
- High-performance data support — designed to handle data rates up to 56 Gbps PAM4, helping maintain signal integrity in high-density systems.
- Design flexibility — multiple pin counts, stack heights and a 1.27 mm pitch help optimize footprint and routing. 1.6 A dedicated power pins are integrated into the connector, helping reduce component count.
- Seamless upgrades and cost-effectiveness — drop-in compatibility allows for direct replacement of existing components, reducing redesign effort, time and cost. The connectors’ BGA technology also offers potential cost savings of up to 20% to 30%.
- Reliability for demanding environments — solder ball terminations help enable a better connection and a rugged mechanical design supports consistent performance. Meets VITA 57.1 — FMC and VITA 57.4 — FMC+ standards for interoperability and system integration.
