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ROHM launches an ultra-compact wireless power chipset for wearables
The chipset is compatible with Near Field Communication technology for compact wearables such as smart rings and smart bands as well as peripheral devices like smart pens.
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Measurement of thermal stress-induced deformation of electronic circuit boards
A combined method of 3D digital image measurement and thermography was developed to measure thermal stress-induced deformation of components as early as the design phase.
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The optical interconnect boom has a manufacturing problem
AI-driven demand for 800G and 1.6T transceivers is tripling the market — and InP laser capacity is struggling to keep pace.
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Altech smart relays and multi-timer combine scalable control and fast installation
The relays come ready to use and, with their compact 72 mm x 90 mm x 65 mm housing, they snap on a DIN rail.
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Bluetooth protocol analysis with 880 MHz of concurrent capture across higher frequency bands
The Frontline X700 delivers unprecedented visibility into Bluetooth operation in emerging higher-frequency bands and simultaneously extends Wi-Fi 7 Multi-Link Operation analysis across three bands.
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Sensors Converge 2026: UpbeatTech highlights vibration sensing across use cases
CEO Jerry Chen demonstrated MEMS-based vibration sensing applications spanning drones, headsets, recording devices and industrial monitoring.
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Marki Microwave acquires LintrinsIC Semiconductors to advance high-power RF switching capabilities
FastSwitch silicon-on-insulator CMOS technology enables nanosecond, high-power switching, strengthening Marki Microwave’s ability to deliver complete, system-level radio frequency (RF) signal chain solutions.
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Littelfuse launches high-voltage TPSMC,TPSMD, TP5.0SMDJ TVS diodes for automotive power protection
The devices are engineered for automotive high-voltage power electronics applications including battery disconnect units (BDUs), high-voltage HVAC systems and positive temperature coefficient (PTC) heaters.
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SECO USA achieves AS9100D certification for aerospace quality management
The certification highlights the company’s commitment to meeting and exceeding the demanding requirements of defense and avionics customers.
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VI-grade and HBK confirm final program for the 2026 Smart Prototypes Summit
The event brings together the full ecosystem of modern vehicle development – from simulation and testing to artificial intelligence (AI)-supported data workflows and digital twin validation.
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RIPSAW M1 robot combat vehicle reaches 53 mph, surveys terrain and fires munitions
The RIPSAW M1 is an uncrewed ground vehicle capable of shifting from reconnaissance to counter-drone roles without structural redesign.
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Sensors Converge 2026: Why digital RF could unlock smart glasses adoption
InnoPhase IoT says advances in digital RF design and low-power Wi-Fi connectivity may help overcome key challenges that have limited the adoption of smart glasses since early devices like Google Glass.
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KRYTAR announces new 4X4 BUTLER Matrix operating from 2.4 GHz to 7.25 GHz
The new power divider offers the ultimate solution for designs and test and measurement applications including emerging mmWave and 6G markets.
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Mitsubishi Electric launches next-generation GOT3000 HMI
The GOT3000 has been engineered to act not only as a machine interface but as a secure gateway between factory equipment and higher-level IT systems.
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A KUKA robot works as a lab assistant at Anton Paar
With a payload of 6 kilograms and a reach of 726 millimeters, the compact six-axis small robot is ideally suited to assist with quality testing in laboratory environments.
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Magnet-driven micro-robots emerge from MIT’s 3D printing breakthrough
The new gel enables individual components of one tiny robot to deform and move independently when exposed to an external magnet, unlike earlier magnetic materials that travel as a single unit.
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Japan explores low-cost cardboard drones designed to evade military detection
Air Kamui built these low-cost drones, dubbed AirKamuy 150, from corrugated cardboard for use as expendable, lightweight, inexpensive aerial targets.
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Micron now shipping data center 245 TB SSDs
The storage is targeted at AI, cloud, enterprise and hyperscale workloads.
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Tackling the “hidden tax” on AI infrastructure by improving timing errors
SiTime introduces a new timing device for AI data centers.
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15 million devices, 60+ brands — Ayla quietly powering the smart home
The company’s platform is protocol- and hardware-agnostic.
