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Supply Chain
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Lidar vendor Quanergy to focus on 3 main IoT segments
The company addressed its renewed focus following its Chapter 11 sale.
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Samsung’s foundry to build Ambarella’s automotive AI chip
The central domain controller will be built on the company’s 5 nm process technology.
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Newark now stocks Nvidia Jetson modules
The system-on-modules can be used for AI edge computing applications.
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Keysight launches wireless test platform for 5G RedCap and cellular IoT industry progression
It is the first network emulation solution for protocol, RF and functional testing of 3GPP NR Re-17 specification.
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Paragraf nabs second factory for graphene manufacturing
The 43,000 square foot facility will double the company’s production footprint.
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Sierra Wireless rolls out new 5G module
The device integrates Sony Semiconductor’s cellular chipset.
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Sensors that provide absolute precision in battery production
The challenge in manufacturing modern batteries is to maximize their energy density, reduce their manufacturing costs and extend their useful life. To achieve these goals, precise sensors are required throughout the entire manufacturing process.
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VisIC Technologies paves the way to high-power GaN traction inverters, successfully operating a battery electric vehicle motor
Tests confirmed that the company's gallium nitride semiconductor technology is well-suited for the most challenging high-power automotive applications.
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ECIA: Electronic component sales sentiment continues momentum
For the month of January, sales beat expectations.
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Onsemi takes control of GlobalFoundries’ 300 mm fab
The facility will manufacture power, analog and sensing ICs.
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SiTime unveils new precision timekeeping IC
The device includes MEMS, analog and system technologies.
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TI makes largest economic investment in Utah with new fab
The $11 billion, 300 mm semiconductor facility will be built next to its existing fab in Lehi.
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First 5G RF chipsets ship from Arctic Semiconductor
Formerly known as SiTune, the chipset is already being used by telecommunications vendors.
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Another step toward reimagining the physical shopping experience
Electronic shelf labels offer new options for retailers and shoppers.
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New benchmarking solution an answer to increasing network complexity
Rohde & Schwarz third generation hardware is backward compatible with other generations.
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Materials for UHDI and advanced packaging fabrication
Many commercial electronics designs have already shifted to an ultra-HDI approach.
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New hand-held spectrum analyzer balances price and performance
Anritsu Company's new device is designed for standard swept spectrum analysis.
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Modulation distortion solution accelerates microwave testing
MiSic Microelectronics is using devices and components from Keysight Technologies.
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New appliance aimed at ‘testing tomorrow’s Ethernet’
Spirent’s new devices are aimed at the entire test life cycle of networking products.
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Ouster and Velodyne complete merger
The new merged company will be called Ouster and will retain about 350 employees with its headquarters in San Francisco and offices globally.
