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This lidar can be integrated into a car’s windshield, roof
Innoviz’s latest device was released at CES 2026.
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Wi-Fi HaLow extends wireless range for IoT devices
The all-in-one device includes a router, access point and extender.
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Test vendors accelerate NTN and UWB trials
Direct-to-cell and digital keys inch toward real-world use as verification of these technologies accelerates.
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Orbbec unveils two stereo 3D cameras for harsh environments, robotics
The cameras offer greater FOV than previous generations.
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Boosting productivity in semiconductor manufacturing with new film-thickness measurement system
This product is a device that measures wafer film thickness in two dimensions using a high-sensitivity camera.
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Innodisk unveils the new “AI on Dragonwing” computing series with the first EXMP-Q911 COM-HPC mini module powered by Qualcomm’s SoC
The module delivers up to 100 TOPS of artificial intelligence (AI) performance while maintaining low power consumption and wide-temperature reliability from -40° C to 85° C.
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UMS unveils new GH10-10, 0.1-µm GaN technology
The technology is optimized to address high frequency applications up to V-band as well as deliver improved linearity and power efficiency at Q-bands and below.
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CES 2026: Temperature and force sensors as small as 1 µm long
Digid plans to scale its sensors even further using its printed electronics fabrication technology.
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Menlo Micro high-standoff protection switch sets new benchmark for RF protection in aerospace and defense
The high-standoff radio frequency (RF) front-end protection solution is designed for the most demanding aerospace and defense applications.
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CES 2026: SDV collaboration emerges between Infineon, HL Klemove
The companies will merge semiconductor design with autonomous driving technologies.
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CES 2026: Nordic Semiconductor simplifies edge AI for billions of IoT devices
Explore how new nRF54L series system on chip (SoC) with NPU and Nordic Edge artificial intelligence (AI) Lab make on-device intelligence easily accessible and radically power-efficient.
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CES 2026: NXP Semiconductors unveils tools for agentic AI deployment
The tools will help to accelerate edge AI development.
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Menlo Micro and Microchip Technology validate the first MEMS-based hot-switched power panel
Successful validation of a 0.5-megawatt system for the U.S. Navy’s 10 MW Advanced Circuit Breaker Development Program demonstrates Menlo Micro’s scalable power-switching platform.
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Weebit Nano secures license agreement with Texas Instruments
The global semiconductor developer has licensed Weebit’s non-volatile memory IP for some of its products.
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CES 2026: Zone controller kit for SDVs launched by Infineon, Flex
The kit will accelerate the development of vehicle architectures.
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Chinese foundry SMIC to take full control of SMNC
The $5.79 billion deal would help the pure-play foundry’s mature node capabilities.
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CES 2026: LG Innotek unveils invisible automotive driver monitor camera
The UDC is installed behind an instrument cluster to sense key status indicators of passengers and drivers.
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Welcome to fabulous CES 2026
AI will be wall-to-wall at the show in a variety of flavors and form factors.
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Keysight accelerates electronic design productivity with secure AI-powered assistants
Artificial intelligence (AI) Chat and Copilot virtual assistants empower faster user experience with Keysight’s Advanced Design System software.
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TI ramps volume production at Texas fab in US manufacturing push
The 300 mm Sherman facility is designed to produce tens of millions of chips per day, strengthening TI’s US-based supply chain.
