Hon Hai Technology Group (Foxconn) and Intel Corp. are collaborating to jointly develop and deploy AI infrastructure and intelligent computing platforms.
Under the collaboration, Intel’s processors, silicon manufacturing and software will be combined with Foxconn’s global manufacturing scale, system integration and AI data center deployment capabilities.
The companies will work on AI solutions for silicon, rack, system and application layers. Additionally, the collaboration will look to accelerate deployment of AI-driven technologies on edge and physical AI applications.
“AI is rapidly transforming industries and society worldwide,” said Young Liu, chairman and CEO of Hon Hai. “Through our ‘3+3+3’ strategy, Foxconn continues to advance key technologies including AI, semiconductors, and next-generation communications, while driving the development of our three core platforms: smart manufacturing, smart EV, and smart city.”
Liu said the deal with Intel will tackle AI infrastructure, edge AI and physical AI ecosystem challenges across a range of AI applications.
AI racks and chips
According to the companies, they will explore the development and commercialization of rack-scale AI infrastructure platforms using Intel’s Xeon-based CPU racks and AI accelerator architectures. It will also focus on advancing data center technologies like:
- High-speed interconnect
- Thermal management
- Liquid cooling
- System telemetry
- AI data center scalability
Additionally, the two companies will explore design services for custom build ASICs, SoCs and system integration solutions that will combine Intel silicon with Foxconn’s design and manufacturing capabilities.
Meanwhile in the edge and physical AI domain, the two companies will develop next-generation AI architectures for agentic AI, edge intelligence and robotics as well as smart manufacturing for smart cities and automotive.
