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Supply Chain
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LPWA chipset available from Sony Semiconductor
The module can be used in asset tracks or smart utility meters.
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A sneak peek into Infineon's latest technologies at APEC 2024
Attendees can expect a sensory overload of presentations on power electronics innovations that will electrify their imagination, including Infineon’s new line of power management devices.
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ECIA: Strong momentum for electronic components to start 2024
And February will continue growth.
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Cambridge GaN devices addresses challenges of data centers and more at APEC 2024
Presentations will address how GaN can play a part in supporting the exponential growth in power demanded by data centers as the use of artificial intelligence proliferates.
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Goepel Electronic brings AR to inspection tasks
The company’s MultiEyeS plus AOI module is used in industrial tasks previously served by a manual approach.
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New InGaAs camera: High resolution, small pixel and low readout noise
The camera functions with sensitivity in the visible to near infrared region from 400 nm to 1,700 nm.
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Live demo of NR+ 5G coming to Hannover Messe 2024
Four companies will showcase the technology for IIoT applications.
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Triad Micro Devices takes flight for aerospace and defense excellence
The company specializes in cutting-edge, integrated and high-reliability analogue and mixed-signal solutions for terrestrial and space applications.
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One-box SSA portfolio for test and analysis
Keysight’s technology offers a DDS source and cross-correlation channels.
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Microchip unveils SiC gate driver solution
Microchip unveils a new offering to meet the demand of widespread electrification.
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Small portable oscilloscope series built for speed
Pico Technology unveils mixed-signal oscilloscopes for a wide range of testing.
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Infineon unveils Bluetooth module for LE-LR use cases
This includes IIoT, smart home, asset tracking, beacons and healthcare.
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10 takeaways from Intel Direct Connect 2024
New partnerships, new customers, Intel’s Chips Act grant and more.
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Intel Foundry expands process technology roadmap
It includes Intel 14A and other specialized nodes.
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GlobalFoundries receives $1.5 billion in CHIPS Act funding
Is Intel next?
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APEC 2024: TI rolls out 2 power conversion device portfolios
The devices include a 100 V GaN and a 1.5 W isolated DC/DC module family.
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Video: Expanding RSIC-V and FPGA design availability
Microchip launches PolarFire SoC discovery kit for students, beginners and professional engineers.
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Power Integrations to present multi-output design solution without DC-DC converters at APEC 2024
Presenters will reveal a revolutionary solution that eliminates the need for DC-DC converters in multi-output power supply designs.
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Renesas to spend $9.1 billion to expand design software library
The Altium acquisition will allow the Japanese chipmaker to create system-level integrated and open electronics system design.
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Vishay Intertechnology 30 V N-channel MOSFET with source flip technology delivers best in class RDS(ON) down to 0.71 mO in PowerPAK 1212-F
The device delivers increased power density and enhanced thermal performance for industrial, computer, consumer and telecom applications.
