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Supply Chain
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20X microscope lens launched to test displays
Radiant’s new technology can test anything from LEDs to micro LEDs and MicroOLEDs.
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Viavi launches CXL device and testbed service expansion
It also acquired Spirent.
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Video: Intel receives ASML’s first High NA EUV system
The system was delivered and installed in its Hillsboro, Oregon, facility.
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Interface standards driving new chiplet designs
Chiplets are small dies connected on an IC substrate, but they also need a standard to allow electronic communication between components and subsystems.
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ABB launches next generation MicroDrive specialized for HVACR systems
The compact drive designed specifically for HVACR equipment allows for lower cost and easier cabinet installation.
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ETS-Lindgren collaborates on wireless testing
Deals with Anritsu and EMQuest expand support for networking and communication protocols.
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The rise of AI PCs
How will computers able to perform AI tasks locally change the user experience?
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Emulating AI workloads over Ethernet
Spirent launches test solution.
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Vishay Intertechnology upgrades TFBS4xx and TFDU4xx Series IR transceiver modules with longer link distance and improved ESD robustness
Offering drop-in replacements for existing solutions, the IrDA-compliant devices feature new in-house IC and surface emitter chip technology.
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New analog chip architecture delivers 10x energy efficiency
The chips could be used in AI or ML in the future.
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Foundry revenue to grow 12% in 2024
The uptick occurs after a down year in 2023 due to a weak economy, high inventory levels and slowing Chinese market.
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Embedded World 2024: Menta to showcase eFPGA platform
It is the first introduction for these heterogeneous chips.
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ECIA: Electronic components reach positive growth in February
It reached this level for the first time in 21 months.
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OFC 2024: Broadcom unveils 51.4 Tbps CPO Ethernet switch
It integrates eight silicon photonics with a switch chip.
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Newark launches product development hub
The hub will help to streamline new products from conception to maintenance.
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A look at semiconductor manufacturing, testing and packaging
The three primary steps in making semiconductors are making the wafer, building the circuit and packaging them.
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OFC 2024: Broadcom expands optical interconnect portfolio
The new devices are aimed at AI and machine learning applications.
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Vishay Intertechnology 80 V symmetric dual MOSFET delivers best in class RDS(ON) in PowerPAIR 3x3FS to increase power density, efficiency and thermal performance
This space-saving device increases power density and efficiency while enhancing thermal performance, reducing component counts and simplifying designs.
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Visit Alliance Memory at Embedded World 2024
New LPDDR4x, eMMC, Flash, SDRAM and lower power SRAM solutions will be displayed.
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Pure-play foundry Tower reportedly to shut down for 3 weeks
About 700 employees will be affected at Tower’s Newport Beach, California, facility.
