A non-destructive means of analyzing computer chips is poised to simplify the workflow of engineers. Instead of applying microscopy techniques after slicing and grinding microchip layers, analysts can now deploy burst ptychographic X-ray laminography (PyXL) technology to generate clear 3D images.
High energy X-rays produced by a synchrotron can penetrate all the way through a chip without the need for the destructive measures previously required. As microscopic features in the chip diffract the light, algorithms are used to reconstruct the most likely version of the image based on the intensity and phase of the diffracted X-rays. The sample is moved on a nanometer scale instead of focusing the Xray beam Users can see though the entire 5 micrometer depth of a chip, as opposed to the 10 to 30 nm depth visible under a transmission electron microscope.
High-resolution view reveals the different layers that make up a microchip. Source: Paul Scherrer Institute/Tomas Aidukas
The method described in the journal Nature has been demonstrated to effectively picture state-of-the-art computer microchips with a resolution of 4 nm, setting a new world record. Inconsistencies and flaws in microchips are quickly detected, indicating that the 3D view provided by the PyXL approach will become an increasingly valuable asset as chips gain more 3D features as part of their architecture and packaging.
Researchers from CSIRO (Australia), Paul Scherrer Institute (Switzerland) and the University of Southern California Los Angeles contributed to this development.
