Semiconductor Equipment

HP gets direct funding from CHIPS Act

28 August 2024

HP is the latest company to receive direct funding through the U.S. Department of Commerce (DOC)’s CHIPS and Science Act. It is the 17th company to receive funding from the bill that was signed over two years ago.

The $50 million in direct funding will be used to support HP’s expansion and modernization of its existing facility in Corvallis, Oregon. The facility is part of HP’s lab-to-fab operation in the region that includes:

  • Research and development
  • Commercial manufacturing operations
  • Microfluidics
  • Microelectromechanical systems (MEMS)

These devices and services are used in life sciences and lab equipment for drug discovery, single-cell research and cell line development. These capabilities serve as focus areas for public health initiatives and enable performance efficiencies for partner institutions across academia, government and the private sector.

The expansion

The Corvallis expansion will help serve as one of three R&D centers for excellence within the company’s global footprint. The project is estimated to create nearly 150 construction jobs and over 100 manufacturing jobs.

The expansion will also work with the Portland Community College on training and recruitment programs. Additionally, the company is working with local contractors, trade unions and other community and workforce partners to implement best practices in increasing participation of women and economically disadvantaged individuals.

“It is imperative that we continue to curate and grow a U.S. semiconductor ecosystem where fabs are receiving the latest technology onshore, and then bringing those innovations to market,” said Laurie E. Locascio, Under Secretary of Commerce for Standards and Technology and National Institute of Standards and Technology Director. “This all happens with proposed investments in companies like HP. The opportunity that companies such as HP have to push our industry further than we’ve ever gone before is inspiring, motivating and an incredible moment to be a part of.”

To contact the author of this article, email PBrown@globalspec.com


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