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Wolfspeed unveils cutting-edge silicon carbide module solution to boost clean energy capacity
The 2300 V modules utilize 200 mm silicon carbide technology to deliver energy efficiency for various applications, including renewable energy and energy storage.
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A bright idea for micro-LEDs
The use of gallium indium nitride nanopyramids has been demonstrated to improve red micro-light emitting diode (LED) emission intensity.
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Smart JTAG solutions and a new inspection platform
GOEPEL electronic will demonstrate the world's first tool for artificial intelligence (AI)-supported test coverage analysis for use with embedded instruments.
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Samsung: No plans to spin off foundry biz
Instead it will look to grow the business.
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Advanced packaging and test come to TSMC’s Arizona fabs
Amkor Technology signed an agreement to expand the region’s semiconductor ecosystem.
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The difference between MOSFETs and BJTs
MOSFETS are generally preferred for digital and analog circuits due to their high input impedance and low power consumption while BJTs are often used in applications requiring high current gain or faster switching speeds.
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Development of IoT devices using the ESP32 processor
For embedded or IoT devices, the ESP32 processor offers Wi-Fi and, in certain variants, Bluetooth connectivity.
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Next-gen packaging materials beyond ABF
ABF holds the dominant share of the semiconductor packaging materials market, but there are alternatives on the horizon.
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Make Way for Electronica 2024 (Nov. 12-15)
Stay tuned to this page as Electronics360 offers exciting coverage of the event in the week before and during the event!
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SEMI: 300 mm fab equipment spending to hit $400 billion
AI chips and regional semiconductor fab building is driving demand.
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Roundup: CHIPS Act funds NSTC; Polar gets final funding
$250 million will be used to help with workforce development in the semiconductor industry.
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Partnership seeks to accelerate SiC adoption in EVs
Soitec and Resonac to collaborate on SmartSiC solution.
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Hybrid SATCOM system demo’d by Northrop Grumman
The solution provided a connection with Viasat and a commercial PLEO vendor.
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Advanced tools come to TMSC’s advanced nodes
Synopsys expands its collaboration with the pure-play foundry.
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Report: Qualcomm potentially positioning to acquire Intel
The mega deal would be the biggest in semiconductor market history.
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How AI could help with counterfeit chip detection
Purdue researchers create a method to identify semiconductor tampering.
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Trends in the advancement of material science
Recent breakthroughs are expanding the understanding of these technologies.
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AI chipmaker Syntiant acquires Knowles MEMS microphone unit
The deal will allow for integrated AI edge solutions for audio and speech recognition.
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Keysight introduces Quantum Circuit Simulation: The first circuit environment with frequency-domain flux quantization
The solution enables faster development of large, highly nonlinear parametric quantum circuits, enhancing qubit readout fidelity.
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Vishay Intertechnology expands inductor product line to enhance sourcing flexibility and performance for customers
The expansion includes new product offerings that cater to applications requiring higher inductance — by an order of magnitude — and higher voltage inductors.
