RSS
Supply Chain
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Report: Japanese foundry Rapidus takes aim at TSMC
The company will price its 2 nm semiconductor manufacturing wafers competitively.
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Another SATCOM deal as York Space acquires All.Space
The deal continues the consolidation in the space communications market taking place in 2026.
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Micron invests $3 billion in GlobalWafers
The deal will include a long-term raw silicon wafer supply and R&D investment.
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Infineon introduces the AIROC UWB TSL100 for precise positioning and smart presence detection on a single chip
These devices combine precise positioning and smart presence detection on a single chip, addressing growing demand across automotive, consumer and industrial markets.
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Ecolab closes $4.75B CoolIT acquisition to corner AI data center cooling
The deal will extend its water technologies to AI infrastructure and computing market.
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Infineon opens largest power chip/logic fab in Germany
It is called one of the largest investment projects in the country.
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New lidar method can measure small objects
It could help in high precision systems for manufacturing.
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Fusion rocket test paves way for superfast interplanetary travel
Pulsar Fusion’s ‘first plasma’ success seen as the first step toward a sustained fusion reaction.
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Intel Foundry breaks ground on Santa Clara facility
It points to continued momentum for the company’s semiconductor manufacturing prowess.
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GM secures a supply of memory, storage chips from Micron
The agreement also includes a collaboration for future memory and storage needs for GM’s vehicle roadmap.
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ECIA: 5 year high for electronic components market sentiment
But July may falter slightly.
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Another big SATCOM deal as Rocket Lab buys Iridium
The $8 billion deal continues a big year of expansion in satellite communications.
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New UCIe routing approach in package substrates
UCIe provides wide channels with high signal counts, and a new transmission line structure could help keep layer counts reasonable as bump count scales up in IC substrates.
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SEMI: AI boosts 300 mm memory fab equipment investment past $50 billion
It is the first time it has hit this dollar mark.
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EPC announces EPC2378 25 V, 410 µO eGaN in mass production for high-density DC-DC conversion
The transistor enables high-density power system designers to achieve higher efficiency, faster switching and greater power density in demanding DC-DC conversion applications.
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Littelfuse launches ultra-low power omnipolar TMR switch sensor
The switch sensor enables high-sensitivity magnetic field sensing with 1.5 µA current draw for always-on, battery-powered designs.
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Export controls slowed China's chip ambitions. They didn't stop them
From advanced chip design to domestic equipment mandates, China's semiconductor ecosystem is building momentum — even without ASML.
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STMicroelectronics introduces secure mobile chip quantum cryptography chip
It is called a world’s first.
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Nokia expands test and packaging operations in Pennsylvania
The site will increase productivity by up to 10 times its current level.
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New 650 V ICeGaN device for automotive applications from CGD helps increase EV range
The device enables engineers to realize smaller, lighter inverters that help extend electric vehicle (EV) range.
