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Supply Chain
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Everspin advances MRAM in aerospace, defense applications
Teledyne HiRel will add the memory technology to its technology portfolio.
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GaN foundries aligning efforts around system-level solutions
A shakeup in market players is not slowing the growth of the technology.
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Sivers expands InP manufacturing capabilities in Scotland
The company will invest $30 million in expanding the facility.
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Lam Research breaks ground on new Oregon lab
It will expand cleanroom lab space by more than 50%.
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High-bandwidth flash in AI memory architectures
HBF provides high capacity to AI processors for storing model weights for inference tasks.
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TI's new coreless sensor reads two-axis fields
The Hall-effect device is targeted at HEV/EV.
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Micron builds first US-dedicated memory research hub
Micron Research Labs will be created through an investment of $10 billion over the next decade.
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How sensors make subsea cables SMART
Sensors integrated into commercially standard telecommunication cables can monitor ocean bottom conditions for climate study and early warning systems for tsunamis and earthquakes,
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Packaging materials may be the next AI roadblock
ABF still corners the market in semiconductor packaging, but new material sets for PCBs, substrates and SLPs are being brought to market.
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The status of in-circuit testing and functional testing
Explore the differences between in-circuit and functional testing as applied to printed circuit board design and manufacturing.
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Dirac Labs' quantum sensors head to field trials
With $1.8 million in pre-seed funding, Dirac Labs will test diamond-based sensors for GPS-free navigation underground and underwater.
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Video: IBM takes a big step toward its Starling quantum computer
The company has successfully joined and cooled down two cryogenic modules into a single environment.
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Lam Research to invest $3 billion on R&D lab network
The investment will be spread out over the next five years.
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Rad-tolerant atomic clock unveiled for new space applications
Microchip’s expanding portfolio of space ICs targets SATCOM, alternative navigation and Earth imaging.
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ECIA: Summer slump hits electronic component sales
But July still beat sales expectations.
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Improving physical AI speech clarity through MEMS and beamforming
A new collaboration between sensiBel and Aizip will target large language model natural human-AI interactions.
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Hamamatsu Photonics Europe strengthens advanced imaging solutions with Fairchild Imaging CMOS sensor technologies
These high-performance complementary metal–oxide–semiconductor (CMOS) image sensors are engineered for demanding X-ray, medical, scientific, space-qualified and other advanced imaging environments.
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Microchip revises Ethernet sensor bridge for edge AI systems
The revision comes as a push for smaller form factors is becoming the norm.
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Rice to develop advanced antennas for future Army systems
The university will create a dedicated research center for sensing, imaging and communication.
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200 W smart amplifier module purpose-built for critical C-UAS and EW applications
Compact form factor and high power density make it ideal for mobile, airborne, shipboard and ground-based defense platforms where space, weight and reliability are critical.
