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InnoPhase IoT unveils Talaria 6 Family of SoCs featuring Wi-Fi 6, multi-protocol connectivity and enhanced cybersecurity
The platform demonstrated at CES 2025 elevates internet of things (IoT) user experience with increased throughput, energy efficiency and range, and increased compute power and security.
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CES 2025: Precise navigation by a two-chip, nine-axis sensor solution
TDK launches PositionSense that integrates a six-axis IMU and a three-axis magnetometer.
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WeWALK unveils smarter, TDK-powered cane at CES 2025
CES 2025 has AI-everything, even a cane that responds to voice commands using TDK MEMS sensors.
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The next level of systems integration: Substrate-like PCBs
This type of integration is where high-density designs are built to include standard PCB components.
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Micron to expand Virgina fab
The facility will be upgraded to produce modern DRAM memory.
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Final 2024 CHIPS Act roundup: Samsung, TI and Amkor funding
What will a change in administration bring for the bill in 2025?
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New TPSMB Asymmetrical TVS Diodes from Littelfuse: Superior gate driver protection for automotive SiC MOSFETs
The series is engineered for next-gen electric vehicle infrastructure, delivering compact, single-component solutions for power efficient onboard charging and inverters.
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Partnership to accelerate development of superconductor technology for power transmission and fusion energy
The partnership seeks to advance the SUBRACABLE innovation which offers potential to overcome limitations of traditional copper cables and current flat tape superconductors.
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How nanosatellites are reshaping global connectivity
Miniaturization in SATCOM will help to lower barrier to entry and improve global communications.
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CES 2025: Tiny integrated speaker-microphone launched
SonicEdge’s device is targeted at TWS earbuds and headphones.
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Hamamatsu unveils the highest-density LD module — A pump source for the 1-kJ laser used in fusion research
Using these laser diode (LD) modules as light sources for pumping the laser medium will achieve laser power in the 1 kJ class, an important milestone in making laser fusion practical.
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Radar for parking assistance comes to CES 2025
Novelic’s 180° FOV radar module replaces ultrasonic sensors in vehicles.
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CES 2025: What new OLED/miniLED TVs will be introduced?
The major brands will debut their latest flagship consumer electronics.
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ED2 is enabling +100 GHz functionality
The solution is ideal for packaging high-frequency amplifiers, attenuators, limiters or multifunction radio frequency devices operating up to 100+ GHz.
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ECIA: Optimism for Q1 2025 rebound in electronic components
This follows a pessimistic outlook for December.
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World’s first 8.5 kW AI data center power supply powered by GaN and SiC
The solution achieves 98% efficiency with high-power GaNSafe and Gen-3 Fast SiC metal-oxide semiconductor field-effect transistors for artificial intelligence and hyperscale data centers.
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NXP collaborates on integrated, scalable radar systems
In a deal with bitsensing, the solutions will be used for automotive, smart cities, robotics, healthcare and more.
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ROHM’s PMICs for SoCs adopted in reference designs for Telechips’ next-generation cockpits
Intended for use inside the cockpits of European automakers, these designs are scheduled for mass production in 2025.
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CHIPS Act roundup: Funding spree continues
Bosch gets preliminary grant; Micron and GlobalWafers finalized investments.
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Littelfuse unveils high-performance Ultra Junction X4-Class 200 V power MOSFETs for enhanced efficiency and reliability
The design delivers industry-leading low on-state resistance, enabling simplified design and enhanced performance in battery energy storage and power supply applications.
