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IEEE International Electron Devices Meeting Announces 2016 Call for Papers

19 April 2016

The 62nd annual IEEE International Electron Devices Meeting  (IEDM) has issued a  Call for Papers  seeking the world’s best original work in all areas of microelectronics research and development. This years event will be held at the San Francisco Union Square Hilton hotel December 3-7, 2016.

The paper submission deadline this year is Wednesday, August 10, 2016. This deadline –– about 1.5 months later than usual for the IEDM – reduces the time between paper submissions and publication of the cutting-edge research results that the conference is known for. Also new for 2016 is that authors are asked to submit four-page camera-ready abstracts (instead of three pages), which will be published as-is in the proceedings.
Because of the more abbreviated schedule, only a very limited number of late-news papers will be accepted. Authors are asked to submit late-news abstracts announcing only the most recent and noteworthy developments. The late-news submission deadline is September 12, 2016.
This year’s IEDM is seeking increased participation in the areas of power, wearable/Internet of Things (IoT), ultra high-speed and quantum computing devices, which will be explored in depth in Special Focus Sessions in each area.
Each year, IEDM gathers leading scientists and engineers in the field of microelectronics from industry, academia and government to participate in a technical program of more than 220 presentations, along with special luncheon presentations and various panels, special sessions, Short Courses, IEEE/EDS award presentations and other events.
Papers in the following areas are encouraged:

  • Circuit and Device Interaction
  • Characterization, Reliability and Yield
  • Compound Semiconductor and High-Speed Devices
  • Memory Technology
  • Modeling and Simulation
  • Nano Device Technology
  • Optoelectronics, Displays and Imagers
  • Power Devices
  • Process and Manufacturing Technology
  • Sensors, MEMS and BioMEMS

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Date Event Location
23-27 Apr 2018 Oklahoma City, Oklahoma
10 May 2018 Pier 94
22-24 May 2018 Los Angeles, CA
04-07 Jun 2018 Boston, MA
06-08 Jun 2018 Los Angeles, CA
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