Discrete and Process Automation

SECO at SPS 2023: Computer-on-modules for demanding industrial applications

17 October 2023

SECO will present its new Smart Mobility Architecture (SMARC) Rel. 2.1.1-compatible module SOM-SMARC-Genio700 as well as other computer-on-module solutions (COMs) at Smart Production Solutions (SPS) 2023. At SECO's booth in Hall 8, Booth 211, visitors can find out how SECO's wide range of COMs can be used to develop innovative solutions quickly and efficiently.

SPS 2023 will take place in Nuremberg, Germany, from November 14 through 16, 2023.

Source: SECOSource: SECO

As a powerful extension to its extensive SMARC product family, SECO is positioning its new SOM-SMARC-Genio700 module. Developers will have the possibility to develop with the help of this COM in its compact SMARC form factor fanless industrial applications that must meet high demands on graphics or artificial intelligence (AI) performance.

Core of the SMARC Rel. 2.1.1 form factor module is MediaTek's new octa-core Genio 700 application processor, designed for industrial internet of things (IoT) products, enabling solutions with the highest performance and low power consumption. The Genio 700 is an N6 (6 nm) IoT chipset and features two Arm Cortex-A78 cores running at 2.2 GHz and six Arm Cortex-A55 cores running at 2.0 GHz, as well as a 4.0 tera operations per second (TOPS) AI accelerator.

Another module named SOM-SMARC-ADL-N is based on Intel Atom processors x7000E series, Intel Core i3 processors and Intel processors N series (codename: Alder Lake-N) and was developed specifically for media processing. The goal of the development was to drastically reduce power consumption as well as the space requirements of video and image-intensive edge applications.

The SMARC Rel. 2.1.1-compliant SOM-SMARC-MX93 module is designed specifically for low power, high processing power applications and uses NXP i.MX 93 processor. Typical applications for SOM-SMARC-MX93 include medical devices, fleet management solutions, charging stations for electric cars and industrial machines.

The COM module SOM-SMARC-EHL is also compatible with SMARC-2.1.1 and is equipped with Intel Atom x6000E series and Intel Pentium and Celeron N and J series (codename: Elkhart Lake) processors. The module was designed primarily for functional safety applications (FuSa).

SECO offers multiple standard form-factor COM solutions, including COM Express and COM-HPC. SECO offers a COM Express Type 6 module under the name SOM-COMe-BT6-RPL-P. It is based on 13th Gen Intel Core processors (codename: Raptor Lake-P) and is suitable for demanding embedded and rugged IoT applications, including solutions for intensive video processing.

SOM-COM-HPC-A-ADL-P, a COM-HPC client module size A with 12th Gen Intel Core processors (codename: Alder Lake - P series), rounds off SECO's portfolio at SPS 2023. Due to its high graphics performance, it is suitable for automation and AI applications at the network edge.

All COM solutions from SECO include a corresponding operating system, a board support package and a software development kit. This enables software developers to implement their applications relatively quickly.

In addition, all SECO hardware products are integrated with Clea and ready for use with their IoT platform. Clea enables the hardware infrastructure to be enhanced with a range of value-added services: device management, remote updates, data pipeline management, all while ensuring the highest levels of security.

Besides product innovations, an additional disruptive revelation awaits visitors to the stand. There will be the opportunity to experience SECO's new brand visual identity and logo, embodying the companies’ commitment to lead the change in an ever-evolving reality. Join SECO on this journey to explore endless ways of shaping a more digital, sustainable and intelligent world.

To contact the author of this article, email GlobalSpecEditors@globalspec.com

Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the GlobalSpec
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter
Find Free Electronics Datasheets