TechInsights Teardown: Magic Leap 2 AR headset

Mixed reality headsets have come a long way since the beginning of the market many years ago.

Now, they are used for many markets beyond just entertainment. Take Magic Leap’s Magic Leap 2 augmented reality headset, which can be targeted for the consumer market but also can be used for other sectors like healthcare and industrial.

The Magic Leap 2 is powered by a Zen 2 CPU from AMD which is a quad-core processor as well as 8 GB mobile SDRAM memory from Samsung.

The following is a partial deep dive into the AR headset from TechInsights.

Summary

• LCOS w dimmer glass
• Compute pack: 16 GB mobile SDRAM
• Controller: 1 GB mobile SDRAM
• 1.4 MP CMOS
• 12.6 MP BSI CMOS

Price: $3,299

Released: September 2022

Availability: Worldwide

Target market: Consumer/industrial

The main board houses the main processor from AMD and main memory from Samsung as well as other electronic components for control of the mixed reality device. Source: TechInsights

Main board

The main board of Magic Leap’s Magic Leap 2 AR headset houses the major components needed for the device to function. It includes the main processor which is a quad-core Zen 2 CPU from AMD and 8 GB mobile LPDDR5 SDRAM from Samsung. Other electronic components include:

• Texas Instruments’ 6 A synchronous step-down converter, 1-phase step-down converter and power monitor
• Winbond’s serial flash memory
• Renesas’ programmable mixed-signal array
• Analog Devices’ power management IC
• Onsemi’s SPDT analog switch, LDO regulators, dual buffer, multiple function gate
• Monolithic Power Systems’ 35 A intelli-phase solution
• TDK-InvenSense’s 6-axis MEMS gyroscope and accelerometer
• ST Microelectronics’ ARM Crotex-M4 32-bit MCU + FPU

(Learn more about power management ICs on Globalspec.com)

The headset board contains the sensors for use when using mixed reality applications. Source: TechInsights

Headset sensor board

The headset sensor board is a small, printed circuit board that is used to identify movement inside the Magic Leap 2 AR headset. The electronic components on the board are TDK-InvenSense 6-axis MEMS gyroscope and accelerometer and AKM Semiconductor’s Hall effect sensor.

(Learn more about MEMS devices on Globalspec.com)

The flex board is one of two boards that is used to control either side of the Magic Leap 2 AR headset. Source: TechInsights

Headset main flex board

There are two main flex boards of the Magic Leap 2 AR headset used to control the left and right side of the headset’s features. The electronic components on the board include:

• NXP Semiconductors’ SPDT analog switch
• Micrel’s white LED driver
• Texas Instruments’ LED driver and power management IC
• Analog Devices’ buck-boost DC-DC converter

(Learn more about LED chips on Globalspec.com)

Some of the major components found inside the Magic Leap 2 AR headset. Source: TechInsights

Major components

• $268.44 — 120 Hz left dimmer subsystem (Qty: 1)
• $268.44 — 120 Hz left dimmer subsystem (Qty: 1)
• $136.53 — Quad-core Zen 2 CPU w/ RDNA 2 GPU — AMD (Qty: 1)
• $38.83 — Left display subsystem — Omnivision (Qty: 1)
• $38.83 — Left display subsystem — Omnivision (Qty: 1)
• $31.91 — Optic fibers with wires (Qty: 1)
• $31.52 — 8 GB mobile LPDDR5 SDRAM — Samsung (Qty: 2)
• $19.26 — 256 GB 3D TLC NAND flash memory — Micron (Qty: 1)
• $16.33 — Neural network processor — Magic Leap (Qty: 1)
• $16.26 — Neural network processor — Magic Leap (Qty: 1)