TechInsights Teardown: Meta Quest Pro
While the buzz word of the metaverse has gained significant traction over the past few years, the reality of the situation is that it is a long way from becoming part of most consumer’s everyday life.
However, virtual reality (VR) is continuing to grow quickly with more games, applications and movies coming online every week. This content is helping to drive sales of VR and augmented reality (AR) headsets to new highs.
Meta is one of the main players in the VR headset space with its line of Quest VR headsets. One of the main headsets that came out late last year. The main components in the headset include a Snapdragon applications processor from Qualcomm and memory from Micron and Western Digital.
The following is a partial deep dive into the Meta Quest Pro headset.
- 2.1 -inch TFT with chip-in-glass 1920 x 1800 pixels
- 2 GB mobile LPDDR5 SDRAM
- 16 MP BSI CMOS 2 x 1.4 MP CMOS
Released: October 2022
Target market: Consumer/gaming
The main board inside the Meta Quest Pro VR headset contains the main operating printed circuit board to control the VR headset. This includes the following electronic components:
- Octa-core Snapdragon XR2+ applications processor from Qualcomm
- 12 GB of mobile LPDDR5 SDRAM multichip memory from Micron
- 256 GB 3D TLC NAND flash from Western Digital
- FPGA from Lattice Semiconductor
- Texas Instruments’ Quad operational amplifier, 16-channel 12-bit PWM LED driver, 4.8 a synchronous boost converter and single buffer/driver
- Display power management IC from AWINIC
- Nexperia’s dual inverter and configurable multiple-function gate
- USB Type-C port controller from Cypress Semiconductor
- Onsemi’s USB Type-C analog audio switch
- Analog Devices’ audio amplifier
- NXP Semiconductors’ OVP load switch
- SGMicro’s two-bit bidirectional voltage-level transistor
- Omnivision’s OVP load switch
The battery board inside the Meta Quest Pro includes electronic components that are needed to operate the battery charging and recharging functions of the VR headset. This includes TI’s battery fuel gauge and Mitsumi’s battery protection ICs.
The microelectromechanical systems (MEMS) found on this component board includes the six-axis gyroscope and accelerometer from TDK-InvenSense.
$51.23 — Octa-core Snapdragon XR2+ — Qualcomm (Qty: 1)
- $38.18 — Left eye display subsystem — BOE (Qty: 1)
- $37.99 — Right eye display subsystem — BOE (Qty: 1)
- $29.71 — Multichip memory — 12 GB mobile LPDRR5 SDRAM — Micron (Qty: 1)
- $25.77 — Multichip memory — 256 GB 3D TLC NAND flash — Western Digital (Qty: 1)
- $13.98 — Battery subsystem — Sunwoda Electronics (Qty: 1)
- $13.19 — Front center camera subsystem (Qty: 1)
- $10.48 — Wi-Fi 802.11 a/b/g/n/ac/ax — Bluetooth 5.0 module — Murata (Qty: 1)
- $8.46 — Front left camera subsystem (Qty: 1)
- $8.44 — Speaker — earbud — average balanced armature speaker (Qty: 2)