Electronic Design Automation

Cadence selected for Qorvo’s DoD initiative

16 February 2022

Qorvo has selected Cadence Design Systems Inc. to participate in the State-of-the-Art Heterogeneous Integrated Packaging (SHIP-RF) Design Center.

The program is a Department of Defense (DoD) sponsored platform to advance leading-edge microelectronics design and manufacturing capabilities in the U.S.

Cadence will provide services, tools and assembly design kits (ADKs) to Qorvo for first-pass design and manufacturing of next-generation RF and mixed-signal systems delivered as both packages and modules.

Cadence will develop methodologies and flows for design and simulation capabilities for 2.5D and 3D heterogeneous integration. This includes technologies developed in alignment with Cadence such as:

  • Allegro Pulse
  • Clarity
  • 3D Solver
  • Celsius Thermal Solver
  • Allegro X Design Platform

Complete modeling and product simulation for aerospace and defense applications will be enabled by integrating Cadence’s ADK solutions with Qorvo’s foundry PDKs and its SHIP-RF Assembly and Test Center manufacturing.

To contact the author of this article, email engineering360editors@globalspec.com


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