Analog/Mixed Signal

Qorvo to build RF semiconductor packaging center for US government

10 November 2020

The U.S. government wants to build a state-of-the-art heterogeneous integration packaging (SHIP) RF production and prototyping center to increase the country’s expertise of both U.S. defense contractors and commercial clients that require design, validation, assembly, test and manufacturing of RF components.

The government selected Qorvo to build the center as part of a $75 million program funded by the Office of the Undersecretary of Defense for Research and Engineering’s (OUSD) Trusted and Assured Microelectronics Program (TAM).

Under the SHIP program, Qorvo will design and deliver heterogeneous packaging integration that is essential to meet the size, weight, power and cost requirements for next-generation phased array radar systems, unmanned vehicles, electronic warfare platforms and satellite communications.

Qorvo’s capabilities include manufacturing, packaging and testing of high and low-power applications ranging from DC to 100 GHz. The company also is a supplier of RF products and compound semiconductor foundry services for global defense and aerospace customers based on gallium nitride on silicon-on-insulator (SiC) and gallium arsenide (GaAs) portfolio.

To contact the author of this article, email engineering360editors@globalspec.com


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