Electronics Industry News & Analysis | Market Outlook & Trends

Teardown: Samsung Galaxy Tab Pro 10.1

The IHS teardown team dives into the Samsung GalaxyTab Pro 10.1 Android tablet.

Apple Touts Record Pre-orders for iPhone 6

Apple said that it has recorded more than four million pre-orders in the first 24 hours, exceeding the demand of the initial pre-order supply

Intel Acquires 1,400 Telecom Patents

Chip vendors agrees to buy patent trove from the Gores Group for undisclosed amount.

SMIC Develops Flash Process As Step To 3D-NAND

SMIC reckons its internally-developed 38nm NAND flash manufacturing process is going to help it serve fabless customers with custom memories in both 2D and 3D component formats.

TSMC Shrinks 28nm CMOS Process

Despite rumors of that is producing a 20nm application processor for Apple, TSMC is touting a tweaked 28nm CMOS process as the way forward for smartphone, tablet computer and TV chips.

Digi-Key Signs Inventek; Mouser Expands Switch Sensor Line

Digi-Key has signed a global distribution agreement with Inventek and will carry the company’s entire line of Wi-Fi and GPS modules and antennas.

Fab Tool Sales Rise in Q2

Semiconductor manufacturing equipment sales increased 28 percent to $9.6 billion in the second quarter compared to the second quarter of 2013, according to trade association SEMI

Flextronics to Build Micromem’s 'Lab-on-a-Chip'

Flextronics has signed an agreement with Micromem Technologies Inc. to build the company’s “lab-on-a-chip”used in vehicles to measure oil levels, temperature and oil condition.

Chip Equipment Spending to Rise 20% in 2015

Front-end fab equipment spending will increase 20 percent to $42 billion in 2015, after rising 21 percent in 2014, according to trade association SEMI.

Pushing the Limits of Wi-Fi

The latest version of Wi-Fi takes wireless communications to a new level. Creating the standard took nearly five years, but results prove that the time was well spent.

ST Introduces MEMS-based IMU for Wearables, IoT

STMicroelectronics (ST) has rolled out an always-on, high performance inertial measurement unit that combines a 6-axis accelerometer with a 6-axis gyroscope targeted at wearable devices and new products involving the Internet of Things.

Toshiba Begins 3D-NAND Fab Construction

Toshiba may seek profit rather market share as it goes forward with 3D-NAND wafer fab construction in Yokkaichi.

Tunnel FETs to Save Power by 2017, Says Toshiba

Toshiba has high hopes for tunnel FET transistors that it has succeeded in implementing in silicon thereby providing CMOS compatibility for devices that could operate at below 0.5V.

Altera, China Mobile To Research C-RAN Mobile Networking

A three-year R&D agreement is expected to lead to lower-power and more scalable multi-standard base station equipment using a cloud-based C-RAN architecture for mobile infrastructure.

Apple Could Be Driving TSMC's Record Sales

TSMC's sales racing 25 percent ahead of where they were a year ago appears to provide evidence that its is being well paid for the millions of application processors that were required for the launch of the iPhone 6.

Intel, Khosla Ventures Back GaN Startup

Avogy, a startup that produces power transistors in GaN-on-GaN wafers, has caught the eye of Intel Capital and a $40 million Series B round of funding.