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First 6G connections to arrive in 2029
U.S., South Korea expected to lead early commercialization.
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TechInsights Teardown: Sony WH-1000XM6 Wireless Noise Canceling Headphones
A partial deep dive into the Japanese headset.
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Anybus Communicators are CRA-ready
Developed using IEC 62443-certified secure product development processes, both hardware and software have been enhanced to support long-term security and lifecycle requirements.
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CommScope to unveil new high-density, ultra-low loss FastSelfClean fiber-optic connector technology
FastSelfClean technology will debut at Computex 2026 as a new approach to reducing loss in data centers’ fiber networks.
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2% points of VR efficiency is worth $12M a year at AI scale
TDK Ventures is backing C2i's software-defined power delivery platform to capture it.
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Melexis MLX90520 dual-input inductive encoder interface IC
The device is designed for absolute rotary and linear motion sensing in demanding robotic and industrial environments.
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How wearable and assistive technologies are reshaping warehouse work
Instead of replacing human labor, wearable technologies function as assistive systems that extend the capabilities of the workforce. By embedding digital instructions into the physical workspace, they enable workers to maintain situational awareness while interacting with data in real time.
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Structured light versus time-of-flight cameras
Structured light and time-of-flight cameras use infrared for depth, but differ in calculation methods and performance for robotics applications.
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Synopsys, Samsung Foundry expand manufacturing deal
The new tools will be used for AI-enabled semiconductors.
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Polar to manufacture power MOSFETs from Nexperia
The deal guarantees a supply of the chips and Polar expands its discrete portfolio
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Micron begins 1-alpha DRAM manufacturing
The company calls it an important step to expand U.S. memory chipmaking.
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The status of connector solutions for data centers
Despite their often-overlooked importance, connectors are fundamental for maintaining consistent power supply, fast data transfer and long-term dependability even when demand is high.
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SEMI: Glass core substrates to grow 67.2% CAGR
From 2028 to 2040, the advanced packaging option is set to grow alongside AI and HPC chips.
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Mouser now shipping new Sensirion SFM3505 high-performance digital mass flow meters for medical and industrial applications
The compact gas flow sensors deliver ultra-low noise, exceptional accuracy and minimal pressure drop for inspiratory flow measurement in medical and industrial applications.
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Guerrilla RF high-power GaN HEMT models now available in Modelithics COMPLETE Library
The availability of these models marks the final step in commercializing Guerrilla RF’s new GaN-on-silicon carbide high-electron-mobility transistor (HEMT) product line.
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New 37-foot robotic submarine can launch missiles, kamikaze drones
The Sinarit XLUUV (Extra Large Uncrewed Undersea Vehicle) from Datum Submarine Technologies is often referred to as Orca by the U.S. Navy.
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US firm unveils UUV for mine detection, seafloor surveys
The UUV, dubbed MANTIS, was developed by Klein Marine Systems and combines imaging with a compact payload design and is integrated with Klein’s SmartArray Technology.
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Rambus brings server-grade memory chips to AI PCs
The chipset includes a clock driver, PMIC and SPD.
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Arivor Technologies launches 2P DLC rack-scale solution advancing liquid cooling upgrades for AI data centers
The solution is designed for next-generation artificial intelligence (AI) data centers exceeding 100 kW per rack.
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Hydrogen sensors for EV battery safety and leak monitoring
The sensors are engineered for embedded EV battery safety systems and other applications requiring robust, real-time hydrogen monitoring.
