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Intel Foundry breaks ground on Santa Clara facility
It points to continued momentum for the company’s semiconductor manufacturing prowess.
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GM secures a supply of memory, storage chips from Micron
The agreement also includes a collaboration for future memory and storage needs for GM’s vehicle roadmap.
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Faster charging for EV batteries
Speedier battery charging can be realized by relying on interfacial anion-reduction catalysis technology.
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Siemens to expand electrical switchgear capacity for data centers
The company will invest about $341 million at its German plants.
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FPT enters the top three of Europe’s certified high-voltage battery producers with TÜV SÜD recognition
The certification covers the design, development and manufacturing process of the FPT eBS 37 EVO high-voltage battery for light commercial vehicles, minibuses and pleasure boating applications.
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Orbital wants 100,000 data center satellites in space
Each satellite would function as one high-density rack in orbit.
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Flir launches the fixed Si2a PD acoustic imaging camera for continuous partial discharge monitoring
The fixed-mount acoustic imaging camera designed to deliver continuous, always-on monitoring of partial discharge (PD) in medium to high-voltage utility and industrial environments.
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PPTC: Compact protection for maximum reliability
The devices provide reliable resettable overcurrent and overtemperature protection for modern electronic applications.
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ECIA: 5 year high for electronic components market sentiment
But July may falter slightly.
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Another big SATCOM deal as Rocket Lab buys Iridium
The $8 billion deal continues a big year of expansion in satellite communications.
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New UCIe routing approach in package substrates
UCIe provides wide channels with high signal counts, and a new transmission line structure could help keep layer counts reasonable as bump count scales up in IC substrates.
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SEMI: AI boosts 300 mm memory fab equipment investment past $50 billion
It is the first time it has hit this dollar mark.
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Data center cabling for the AI era
A complete rethinking of traditional data center design, including cable components, is required to deploy future artificial intelligence (AI)-driven applications.
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Emerson unveils AI-ready test automation platform
NI Nigel AI has been expanded across the Emerson test software portfolio, introducing new prompt-based code generation and offering an integrated, artificial intelligence (AI)-ready test automation platform.
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EPC announces EPC2378 25 V, 410 µO eGaN in mass production for high-density DC-DC conversion
The transistor enables high-density power system designers to achieve higher efficiency, faster switching and greater power density in demanding DC-DC conversion applications.
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Online event: Thermography for industrial automation
Learn how temperature distributions and temporal temperature profiles can be captured, analyzed and used for effective process monitoring.
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New Epson low-power OCXO redefines precision timing for AI and edge infrastructure
The power- and footprint-saving oven-controlled crystal oscillator (OCXO) delivers the ultra-stable timing performance required for artificial intelligence (AI), edge and next-generation communication infrastructures.
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Robotic snakes crawl along power lines to identify failures before they occur
The snake-like robots wrap themselves around power lines while using onboard cameras and sensors to detect hazards like damaged wires, worn components and abnormal temperatures – all of which are possible signs of imminent failure.
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Littelfuse launches ultra-low power omnipolar TMR switch sensor
The switch sensor enables high-sensitivity magnetic field sensing with 1.5 µA current draw for always-on, battery-powered designs.
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Export controls slowed China's chip ambitions. They didn't stop them
From advanced chip design to domestic equipment mandates, China's semiconductor ecosystem is building momentum — even without ASML.
