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More light, greater efficiency, better growth
These LEDs for controlled plant cultivation set new standards for professional lighting solutions in greenhouses and in controlled environmental agriculture.
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FXP30x and PC30x series from Taoglas combine cellular, GNSS and Wi-Fi in compact PCB antennas
The compact antennas are designed to support cellular, GNSS and Wi-Fi connectivity for space-constrained electronic devices.
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Optris expands the CTi series for glass and plastics processing
With optimized spectral ranges, fast response times and extensive interface options, the new pyrometers enable precise and reliable non-contact temperature measurement across a wide variety of applications.
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US reveals new self-driving microwave weapon capable of taking down entire drone swarms
The Leonidas Autonomous Ground Vehicle (AGV) is a self-driving counter-drone system that features a high-power microwave weapon and is built on the medium-truck chassis of a Ford F-600.
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Heat-triggered knot robots jump hundreds of times their height — No electronics required
A knot just a few millimeters long, can reportedly achieve heights that are hundreds of times its own size.
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6G’s software-defined future
Telecom operators aim to make 6G an AI-driven, cloud-native evolution — preserving 5G infrastructure while accelerating innovation through software.
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French firm unveils AI system to simplify autonomous underwater mine warfare
The Expeditionary PathMaster is a system that can go from the harbor to the open sea, and operated from the shore, from a rib, a mine hunting ship or virtually any platform, empowering navies to act fast, secure critical infrastructure, and dominate expeditionary and amphibious operations.
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TechInsights Teardown: Supermicro server with 8 AMD Instinct MI 350X and 2 AMD EPYC Turin 9555
A partial deep dive into the data center server.
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Intel gaining momentum in foundry business
More equipment orders, closer ties with Terafab and advanced packaging are gaining significant interest.
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Marvell adds to optical portfolio with Polariton acquisition
Its plasmonics-based modulation technology will be combined with Marvell’s silicon photonics and DSP capabilities.
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Samtec AcceleRate Slim Cable Assemblies available with new signaling options
These assemblies support high-density computing, field-programmable gate array (FPGA) prototyping and emulation, and Mobile Industry Processor Interface Alliance (MIPI) protocols.
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Vishay Intertechnology 200 V FRED Pt ultrafast rectifiers deliver high current ratings up to 15 A in new DFN6546A package
The space-saving, high efficiency devices provide current ratings from 6 A to 15 A and are available in commercial and automotive grade, AEC-Q101 qualified versions.
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FXP30x and PC30x series from Taoglas combine cellular, GNSS and Wi-Fi in compact PCB antennas
These enable engineers to integrate multiple wireless technologies within a single antenna, reducing device component count while simplifying device design, speeding up assembly times and accelerating time-to-market.
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High-performance Si PIN photodiode for FSO, laser and analysis applications
With strong infrared sensitivity and high response, this model expands the toolkit available for optical measurement, free space optical (FSO) communication and dimensional analysis.
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Rohde & Schwarz to highlight its R&S EVSD1000 UAV-based navigation analyzer at IFIS 2026
The company will demonstrate its test and measurement solutions for ground-based navigation aids.
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60 years of fiber optics: How a carrier of light you can’t see underlies much of the modern world
Learn about the evolution and principles of fiber optics, which carry information in the form of light over long distances.
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More speed, more scaling with Rittal and Eplan: How the industry is securing its competitiveness
Discover how the intelligent interaction of software, hardware and automation enable products to be developed faster, produced more cost-effectively and bring significant added value.
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TE Connectivity launches 56G MezzaWave connectors and cable assemblies
Built to support data rates up to 56 Gbps PAM4 in high-density environments, these products help enable high-performance connectivity and exceptional signal integrity for advanced systems.
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Advanced Chip and Circuit Materials introduces negative and near-zero CTE materials to eliminate thermomechanical constraints for large-format AI chips
These dielectric materials address thermomechanical mismatch problems encountered while scaling large-scale chips for artificial intelligence (AI) circuits.
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The unglamorous layer beneath fab cleanrooms is getting its first research lab
ISRL USA and AI Infrastructure Partners are partnering to build the industry's first dedicated subfab R&D facility.
