Editor’s note: Information from this teardown is supplied courtesy of TechInsights. Click here to request full access. To view a complimentary report of the Summary — Philips 5000 Series, click here.
As the smart home evolves, it has become easier to increase security in the home via sensors and cameras. One of the biggest benefits of this boom has been the doorbell camera.
A device that takes the place of a traditional doorbell with a smart camera that works not just in the day but as well as at night. Not only can users see live broadcasts happening outside of their homes, but they can communicate with anyone near the doorbell through the microphone and speaker.
Brands like Ring, Google Nest, Blink, Arlo and more have become their own cottage industry inside the smart home market and is one of the largest categories in the sector.
The Ring Wired Doorbell Pro smart home device is the latest edition of the popular camera uses a camera SoC with memory from SigmaStar with a Wi-Fi/Bluetooth module from MediaTek and a Sunny Optical wide-angle camera subsystem to keep costs down to a minimum.
The following is a partial deep dive into the Ring Doorbell Pro conducted by TechInsights.
Summary
- No display
- 12 MP wide-angle camera
Released: September 2025
Price: $249.99
Target market: Consumer
Availability: Worldwide
The main board found inside of the Ring Doorbell Pro (Gen 3) smart home device. Source: TechInsights
Main board
The main board of the Ring Doorbell Pro (Gen 3) includes the main processor for the unit as well as the communication chip. The electronic components on this board include:
- Winbond’s serial flash memory
- MediaTek’s Wi-Fi 6/Bluetooth 5.2 transceiver
- Texas Instruments’ 16-bit ADC, 300 mA/2.8 V LDO regulator, H-bridge motor driver
- Global Mixed-mode Technology’s load switch
- RichTek’s three-amp buck-boost converter
- Pan Jit Semiconductor’s N-channel power MOSFET
(Learn more about discrete components on Globalspec.com)
Auxiliary board
On the auxiliary board of the Ring Wired Pro (Gen 3) smart home device is the RichWave 5 GHz Wi-Fi 7 front-end module, Semtech’s LoRa transceiver and Silicon Labs’ Bluetooth 5.2 system-on-chip.
(Learn more about communication ICs on Globalspec.com)
Power board
The electronic components found on the Ring Wired Pro (Gen 3) camera’s power board include:
- Global Mixed-mode Technology’s load switch
- Tech Public’s dual Schmitt-trigger buffer
- Texas Instruments’ 7-bit LED driver, N-channel power MOSFET, 18 channel 12-bit PWM RGB LED driver
- Renesas’ programmable mixed signal array
- Lite-on Semiconductor’s ambient light/proximity sensor
- Diodes Inc.’s P-Channel power MOSFET
- Analog Devices’ Class-D amplifier
(Learn more about light sensor chips on Globalspec.com)
Main components
- $27.52 — Wide-angle camera subsystem — Sunny Optical (Qty: 1)
- $11.94 — Camera SoC w/ memory — SigmaStar (Qty: 1)
- $5.99 — Wi-Fi 6/Bluetooth 5.2 transceiver — MediaTek (Qty: 1)
- $2.75 — Eight-layer buildup FR4/HF — Huaian (Qty: 1)
- $2.56 — Internal metal chassis (Qty: 1)
- $1.62 — Small passive: Cap, Res, Ferrite (Qty: 405)
- $1.24 — Two-layer Flex w/Vias (Qty: 1)
- $1.09 — Small passive: Cap, Res, Ferrite (Qty: 272)
- $1.00 — Four-layer Buildup FR4 / HF — Huaian (Qty: 1)
- $0.97 — Cable: Flex/w Bd to Bd (Qty: 1)
