Editor’s note: Information from this teardown is supplied courtesy of TechInsights. Click here to request full access. To view a complimentary report of the Xiaomi 15S Pro (25042PN24C) Deep Dive Teardown click here.
Like clockwork, Apple introduces a new iteration of its popular smartphone, the iPhone. Its latest iteration included a “Air” variant that is billed as the thinnest iPhone on the market but with the power of the A19 Pro chip inside.
While the Air variant is a throttled down version of the iPhone or iPhone Pro, it still has a fast processor, 120 Hz OLED screen but just one camera — which may be a deal breaker for many.
That said, it may appeal to those who don’t want a bulky smartphone or who want one that is easier to handle but still can do most of the same functions as its larger siblings.
TechInsights did a teardown into the Apple iPhone Air and this is a partial look at that teardown.
Summary
- 6.53 inch AMOLED — Plastic, 2736/1260 pixels, 1073741824 colors
- 12 GB Mobile LPDDR5X SDRAM
- 18 MP BSI CMOS, f/1.9, AF
- 48 inches MP BSI CMOS (wide-angle), f/1.6, OIS Dual LED Flash
Released: September 2025
Price: $999
Availability: Worldwide
Target market: Consumer
The main board found inside the Apple iPhone Air smartphones. Source: TechInsights
Main board
The main board houses the heart of the Apple iPhone Air including the main Apple A19 Pro processor and Micron’s multichip memory 12 GB mobile LPDDR5X SDRAM. Other electronic components include:
- SGMicro’s two-bit bidirectional voltage-level translator
- Texas Instruments’ flash LED driver, AMOLED display power supply
- Analog Devices’ buck-boost regulator and A/D converter
- Apple’s power management with discretes, Wi-Fi 7 Bluetooth 6/Thread module
- Onsemi’s synchronous boost regulator
- Broadcom’s FBAR filter and HB and MB front-end module
- Qualcomm’s Dual BAW filter
- Skyworks’ 2.4 GHz Wi-Fi front-end module, RF switch/couplers and GPS L1 LNA
- Murata’s 5 GHz front-end module
- NXP Semiconductors’ authentication IC and USB Type-C controller
- Qorvo’s GPIO interface and 5G average power tracker
- Bosch Sensortec’s six-axis MEMS accelerometer and gyroscope
(Learn more about logic devices on Globalspec.com)
The secondary board found inside the Apple iPhone Air smartphones. Source: TechInsights
Secondary board
The secondary board of the Apple iPhone Air includes the following electronic components:
- Murata’s 5 GHz front-end module
- USI’s U2 UWB module
- Qualcomm’s FBAR filter
- Apple’s audio amplifier and power management IC
- ST Microelectronics’ camera power management
- NXP Semiconductors’ NFC controller and secure element chip
(Learn more about power management ICs on Globalspec.com)
The 48 megapixel camera board found inside the Apple iPhone Air smartphones. Source: TechInsights
48 MP wide-angel rear camera
The rear camera of the Apple iPhone Air includes the following electronic components:
- Onsemi’s LDO regulator and 200 mA/2.85 V LDO regulator
- Sony’s 48 MP BSI CMOS image sensor
- Texas Instruments’ 300 mA/2.0 V LDO regulator
- Cirrus Logic’s autofocus/OIS motor driver
(Learn more about sensors on Globalspec.com)
Major components
- $92.63 — 64-bit hexa-core applications processor — Apple (Qty: 1)
- $45.81 — 48 MP wide-angle rear camera subsystem — LG Innotek (Qty: 1)
- $45.39 — Multichip memory — 12 GB mobile LPDDR5X SDRAM — Micron (Qty: 1)
- $40.51 — 120 Hz display/touchscreen subsystem (Qty: 1)
- $24.33 — Baseband processor w/ memory — Apple (Qty: 1)
- $19.83 — 18 MP front camera subsystem — Sharp (Qty: 1)
- $18.69 — RF transceiver plus GPS — Apple (Qty: 1)
- $18.62 — Main enclosure (Qty: 1)
- $16.96 — Multichip memory — 256 GB 3D TLC NAND Flash, memory controller — Samsung (Qty: 1)
- $15.79 — Wi-Fi 7/Bluetooth 6/Thread module — Apple (Qty: 1)
