Discrete and Process Automation

Emerson to showcase Floor to Cloud packaging solutions at PACK EXPO 2023

07 September 2023

Emerson will exhibit its Floor to Cloud packaging solutions at PACK EXPO Las Vegas, September 11 to 13, 2023. As the future of automation, Floor to Cloud solutions empower smarter packaging lines and more efficient processes that make it possible for manufacturers to continuously improve plant productivity, sustainability and safety.

Visitors to South Lower Hall, Booth 6107, can view highlights from the comprehensive Floor to Cloud portfolio, which includes AVENTICS, Branson, Movicon, PACEdge and PACSystems solutions. Packaging automation experts will demonstrate how a Floor to Cloud approach unlocks trapped data and connectsSource: EmersonSource: Emerson islands of automation, giving manufacturers the visibility and control to solve critical challenges and ambitious goals. Attendees will learn how to improve overall equipment effectiveness (OEE), increase energy efficiency while reducing waste, and create safer operations and digital record keeping.

Emerson will also be highlighted as an industry expert in the new Sustainability Central presented by PMMI and curated by Fuseneo. Located in North Hall (Booth N-9455), Sustainability Central is an interactive experience that demonstrates how manufacturers can achieve packaging sustainability.

Presentation and event highlights
In addition to showcasing its advanced Floor to Cloud packaging automation solutions, Emerson will also sponsor two events, the annual Packaging & Processing Women’s Leadership Network (PPWLN) breakfast and the Amazing Packaging Race.

All women who are registered for PACK EXPO Las Vegas are invited to the free PPWLN breakfast and program on Tuesday, September 12, at 7:30 a.m. in Room N-247. Following the breakfast, attendees will have the opportunity for a private show floor tour and participate in a Q&A with Lisa Propati, vice president and general manager of Weiler Labeling Systems, as well as other packaging executives.

As part of the Amazing Packaging Race, teams from U.S. colleges, trade schools and universities race to complete tasks and solve problems at booths across the PACK EXPO Las Vegas show floor.

Product highlights

AVENTICS Series Advanced Electronic System (AES) With Integrated OPC UA

The award-winning AVENTICS Series Advanced Valve (AV) system with Advanced Electronic System (AES) is the first pneumatic valve system with an integrated Open Platform Communications Unified Architecture (OPC UA). The AES helps interoperability challenges and accesses data more easily, while the digital twin integration improves productivity efficiency and reduces costs. In 2022, the AVENTICS Series AV system with Advanced AES won an Endeavor IDEA! Award, earned silver in the LEAP Awards and was named a finalist for the NED Innovation Awards.

AVENTICS Series AF2 flow sensor

AVENTICS Series AF2 flow sensors have helped plants around the world successfully reduce compressed air Source: EmersonSource: Emersonconsumption and improve energy efficiency. By monitoring air consumption in pneumatic systems, AF2 sensors enable rapid intervention if leaks occur, helping optimize energy consumption, reach net-zero targets, prevent machine downtime and reduce costs. Emerson now offers a high-flow model of this advanced sensor that propels compressed air monitoring beyond individual machines to benefit larger air lines and systems. This expanded capability allows users to easily optimize energy consumption across an entire packaging facility and improve overall plant sustainability.

Multimedia monitoring solution

The multimedia monitoring solutions, including CoreTigo wireless communication, analyze water, compressed air, gases, electricity, steam (WAGES) and other utilities. The Edge Analytics Dashboard measures efficiency, optimizes productivity and avoids or reduces downtime. Emerson experts will demonstrate the multimedia monitoring cabinet solution and the insights it offers, which will support meeting sustainability goals.

To contact the author of this article, email GlobalSpecEditors@globalspec.com


Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the GlobalSpec
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Advertisement
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter
Advertisement
Find Free Electronics Datasheets
Advertisement