NextFlex has secured $6.49 million in funding to support seven flexible hybrid electronics (FHE) projects across the U.S. advanced manufacturing sector.
As part of Project Call 8.0, the awarded projects address critical needs in domestics advanced semiconductor packaging capabilities, which is directly one of the technical areas of interest outlined in the CHIPS and Science Act — the bipartisan legislation designed to bring semiconductor manufacturing back to the U.S. in force.
Project Call 8.0 focused on using FHE technology for manufacturing processes and materials to improve environmental sustainability in electronics manufacturing. This includes the maturation of processes using biodegradable and recyclable substrates, low temperature cure water-based inks and electronics recycled/reworked for reduced e-waste production.
According to NextFlex, the projects will build on previously funded FHE investments like electronics manufacturing, additive electronics packaging and advancing the manufacturing readiness level of critical processes.
The latest fundraising from NextFlex will go to five companies across seven projects.
Lockheed Martin and Binghamton University will use the funds for high resolution copper printing for RF antenna and multi-layer balun structures.
Two projects were funded by The Boeing Company for maturing additive die packaging for cryogenic and high temperature operations for additive printing and the production of hybrid integrated receiver electronics and sensors that are sustainable.
Two projects will focus on demonstrating mold flexible electronics reliability for harsh automotive applications by Auburn University.
Iowa State University will validate technology for real-time process monitoring and control for aerosol jet printed electronics.
Finally, GE Research and Binghamton University will develop and demonstrate additively packaged microelectromechanical systems (MEMS) inertia measurement units for harsh environments.