Power Semiconductors

Video: MediaTek launches flagship smartphone chipset

08 November 2023

Taiwan chipmaker MediaTek has unveiled its latest Dimensity mobile semiconductor designed for gaming, video capture and on-device generative artificial intelligence (AI) processing.

Called the Dimensity 9300, the mobile processor uses MediaTek’s big core design — using Taiwan Semiconductor Manufacturing Co.’s (TSMC's) third generation 4 nm process with four Arm Cortex-X4 cores with operating speeds of up to 3.25 GHz and four Cortex-A720 cores operating up to 2.0 GHz.

This allows a processing speed performance of 8 times faster than MediaTek’s previous generation mobile processor.

Other features of the Dimensity 9300 are:

  • Double integer and floating-point operations performance
  • Power reduction by 45%
  • Support for NeuroPilot Fusion
  • 5G mmWave support
  • LPDDR5T 9600Mbps support
  • WQHD displays at 4K up to 120 Hz
  • Support for large AI language models with 1B, 7B and 13B parameters
  • Wi-Fi 7 support
  • Integration of MediaTek’s Xtra Range technology.
  • Multi-modal generative AI support including Meta Llama 2, Baichuan 2, Baidu AI LLM and more

MediaTek said the mobile processor is designed to work with the Arm Immortalis-G720 GPU, offering a 46% boost in GPU performance at the same level of power consumption as the previous mobile processor generation, the Dimensity 9200.

To contact the author of this article, email PBrown@globalspec.com


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