Memory semiconductor vendor Micron Technology Inc. has started shipments of its 32 Gb DRAM die-based 128 GB DDR5 RDIMM memory targeted for artificial intelligence (AI) data centers.
The memory ICs deliver more than 45% improved bit density, up to 22% improved energy efficiency and up to 16% lower latency over current 3DS through-silicon via (TSV) products, Micron said.
The memory can be used in data centers for AI, machine learning, high-performance computing (HPC), in-memory databases (IMDBs) and efficient processing for multithreaded, multicore general compute workloads. Micron said the memory is supported by server ecosystem suppliers AMD, Hewlett Packard Enterprise, Intel, Supermicro and more.
“AI servers will now be configured with Micron’s 24GB 8-high HBM3E for GPU-attached memory and Micron’s 128GB RDIMMs for CPU-attached memory to deliver the capacity, bandwidth and power-optimized infrastructure required for memory intensive workloads,” said Praveen Vaidyanathan, vice president and general manager of Micron’s Compute Products Group.
