Intel Foundry, the semiconductor manufacturing division of Intel Corp., has been awarded phase three of the U.S. Department of Defense's (DoD's) Rapid Assured Microelectronics Prototypes—Commercial (RAMP-C) program.
The award was given through the National Security Technology Accelerator’s (NSTXL) consortium-based Strategic and Spectrum Missions Advanced Resilient Trusted Systems Other Transaction Authority (S2MARTS OTA) program.
As part of the third phase, the tape-out and testing of early defense industrial base product (DIB) prototypes will be advanced using Intel’s 18A process technology, intellectual property (IP) and ecosystem solutions for high-volume manufacturing.
RAMP-C customers can begin manufacturing commercial and DIB product prototypes on the 18A process as part of the deal.
About RAMP-C
RAMP-C is designed to bring leading-edge semiconductors back to domestic manufacturers by incentivizing the creation of a commercial foundry ecosystem in the U.S.
DIB and commercial customers are allowed to fabricate custom integrated circuits required for DoD systems and commercial products in these foundries that have been pre-approved and meet the requirements for the projects.
Previously, Intel led the first phase of the RAMP-C program, helping the company gain a foothold in the foundry business with its technology yield plans, IP development and tools. Phase two was expanded by onboarding Boeing and Northrop Grumman to design, develop and tape-out solutions based on Intel’s 18A process technology.
Phase three will open the extensive testing of these DIB and commercial prototype tape-outs.
