Supply Chain
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Shipments of AI chipsets to reach 1.3 billion by 2030
Driven by demand in PCs, game consoles, smartphones and other smart devices.
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Vishay Intertechnology 600 V E series power MOSFET delivers industry's lowest on-resistance
The fourth-generation device enables higher power ratings and density versus D²PAK while lowering conduction and switching losses to increase efficiency.
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AMD FPGA development kit rolled out by Avnet
The kit is designed for networking applications, vision and video processing and secured connectivity.
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CHIPS Act opens $285 million digital twin R&D project
The CHIPS Manufacturing USA Institute will focus on semiconductor manufacturing, advanced packaging and more.
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Empower’s new ultra-low 1 pH ESL silicon capacitor tightens voltage regulation for AI chips
The silicon capacitor is suitable for embedding into any system-on-chip substrate or interposer.
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Keysight introduces new testing capabilities to strengthen post-quantum cryptography
New industry-first testing capabilities address the demand for improved security in the post-quantum era.
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Tunnel diodes and their applications
A tunnel diode is a special type of diode known for its unique characteristic — negative resistance.
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Pure-play MEMS foundry begins construction 300 mm fab
Rogue Valley Microdevices Florida facility will be the first from a MEMS specialty foundry.
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Production begins on first optical beamforming chip
SkyWater and Lumotive call it the world’s first.
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Micron begins shipping AI data center specific memory
The technology allows for improved bit density, energy efficiency and lower latency.
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Rambus unveils DDR5 PMIC device family
The devices complete a memory interface chipset for data center use cases.
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Omnivision creates machine vision unit, unveils 2 sensors
The global shutter image sensors includes a 2.2-micron backside-illuminated pixel for a higher resolution in applications.
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Expect more High-NA EUV lithography purchases soon
ASML sold and delivered a second device recently.
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IBM invests $137 million in Canadian chip industry
The funding will be used to expand chip packaging capacity and strengthen R&D.
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Hughes Networks opens 5G incubation center
The facility will build LEO satellite terminals and modems as well as a training facility.
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Micron approved for $6.14 billion in CHIPS Act funding
The funding will be used to build the first memory fabs in the U.S. in decades.
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Rohde & Schwarz expands footprint in India by opening new state-of-the-art facility in Bengaluru
The company has inaugurated a new facility center in Bengaluru’s Manyata Tech Park, housing R&D, system integration as well as calibration and repair services.
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Rambus unveils GDDR7 memory controller
The device is designed for AI 2.0
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Third phase of DoD’s RAMP-C program award to Intel Foundry
It will involve tape-out and testing of early DIB and commercial prototypes.
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Pickering launches switching range for test system
The technology has low signal level performance and high density switching capabilities.
