RSS
Supply Chain
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Onto Innovation launches subsurface inspection function in testing equipment
The capability reduces potential for scrapped wafers.
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Arctic unveils 3GPP compliant platform for 5G private networks
The 3GPP compliant system includes Skyworks’ family of power amplifiers and timing products.
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Tektronix releases upgrade to its multi-signal analysis tool
The software works with applications requiring time-domain analysis with RF measurements.
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Siemens unveils neural network software for ASICs, SoCs
The AI-based tool is used for high level synthesis.
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Keysight’s handheld RF analyzer line adds pulse generation option
It is said to be the only such analyzer with an embedded pulse generator.
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Nexperia’s premier SiC MOSFETs now come in the increasingly popular D2PAK-7
The 1,200 V devices now deliver class-leading performance in surface mount device packaging.
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Vision platform gives a new look to optics research
With Moku for visionOS, users can leverage hand and eye gestures alongside a reconfigurable suite of test instruments to accelerate optics, photonics and quantum research.
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Automotive sensor unveiled for ADAS and autonomous driving
Omnivision’s CMOS IC is designed for HDR, low-light and LFM applications.
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Video: Intel unveils rendering of its Ohio campus
Currently under construction, the site will house two new semiconductor fabs for its foundry business.
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Murata’s LCT reduces noise, component count
The electronic component also decreases cost.
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ECIA: Electronic components continue strong sales momentum in April
May looks good too.
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Polar Semiconductor to become US commercial chip foundry
Through CHIPS Act funding, the company will go from foreign-owned in-house manufacturer to a U.S.-owned chipmaker.
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Guerrilla RF completes strategic acquisition of GaN device portfolio from Gallium Semiconductor
The company intends to significantly enhance ongoing efforts to develop a new line of gallium nitride (GaN) devices tailored for wireless infrastructure, military and satellite communications applications.
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Report: Intel and 14 Japanese vendors to develop back-end chipmaking
The goal is to achieve automated equipment technology by 2028.
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Alliance Memory 16 Gb and 32 Gb LPDDR4X SDRAMs combine low-voltage operation, fast clock speeds and high data rates
The devices increase power efficiency and performance in consumer, commercial and industrial applications, and extend battery life in portable electronics.
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Two big reliability problems in advanced packaging
New packaging and substrate modalities bring unique perspectives to reliability challenges.
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PowiGaN enables simple and efficient 28 V USB PD EPR adapter designs — Design kit available
This ultra-compact 140 W USB PD 3.1 EPR adapter design employs two 750 V PowiGaN-based devices to achieve high efficiency and high power density with a minimal number of active components.
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SIA: US on track to expand chip manufacturing 203% by 2032
This will be the largest increase in the world over this time.
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Shockley diodes and their applications
Similar to other devices called thyristors, a Shockley diode acts like a switch.
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Report: Apple developing an AI chip with TSMC
The processor would be targeted for data centers.
