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Electronics and Semiconductors

Integrated Power Module Solution Suits Next-Generation Automotive BLDC Systems

04 August 2016

ON Semiconductor has expanded its portfolio of automotive Power Integrated Modules (PIMs)with the STK984-190-E. Optimized for driving three-phase brushless DC motors in modern automotive applications, this module contains six 40 V, 30 A MOSFETs configured as a three-phase bridge with an additional 40 V, 30 A high-side reverse battery protection MOSFET.

STK984-190-E integrated power module. Source: ON Semiconductor. STK984-190-E integrated power module. Source: ON Semiconductor.

The MOSFETs are mounted onto a direct bonded copper (DBC) substrate, resulting in a compact module with excellent thermal performance, and taking up only half of the board space used by an equivalent discrete solution.

The module is suitable for use in 12 V automotive electric motor drive applications with power ratings up to 300 W, such as electric pumps, fans and windscreen wipers. Used in combination with motor controllers such as LV8907UW, designers can build a high-efficiency BLDC solution with best- in-class thermal performance, built-in diagnostics and an ultra-small PCB that saves critical size and weight.

Using the module allows both the component count and the bill of materials costs to be reduced substantially. The DBC substrate reduces the thermal resistance, which reduces the operating temperature of the MOSFETs. This reduces power losses and increases reliability due to a reduced change in temperature during thermal cycling. Reliability is also improved by the isolation provided by the DBC substrate. STK984-190-E has a specified operational temperature range of –40° C to 150° C. The integrated MOSFETs are all AEC-Q101-qualified.

The STK984-190-E is supplied in a lead-free DIP-S3, measuring 29.6 mm x 18.2 mm x 4.3 mm. List price is $7.00 per unit in 16-unit quantities.

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