STK984-190-E integrated power module. Source: ON Semiconductor.
The MOSFETs are mounted onto a direct bonded copper (DBC) substrate, resulting in a compact module with excellent thermal performance, and taking up only half of the board space used by an equivalent discrete solution.
The module is suitable for use in 12 V automotive electric motor drive applications with power ratings up to 300 W, such as electric pumps, fans and windscreen wipers. Used in combination with motor controllers such as LV8907UW, designers can build a high-efficiency BLDC solution with best- in-class thermal performance, built-in diagnostics and an ultra-small PCB that saves critical size and weight.
Using the module allows both the component count and the bill of materials costs to be reduced substantially. The DBC substrate reduces the thermal resistance, which reduces the operating temperature of the MOSFETs. This reduces power losses and increases reliability due to a reduced change in temperature during thermal cycling. Reliability is also improved by the isolation provided by the DBC substrate. STK984-190-E has a specified operational temperature range of –40° C to 150° C. The integrated MOSFETs are all AEC-Q101-qualified.
The STK984-190-E is supplied in a lead-free DIP-S3, measuring 29.6 mm x 18.2 mm x 4.3 mm. List price is $7.00 per unit in 16-unit quantities.
