Aerospace

MicroQSFP connector offers increased density and better thermal performance. 

01 August 2016

TE Connectivity (TE), a world leader in connectivity and sensors, announced the launch of its micro Quad Small Form-Factor Pluggable (microQSFP) product line-- the next generation of pluggable input/output (I/O) interconnects. The microQSFP connectors help solve key challenges relating to bandwidth, thermal performance and energy costs in data storage centers.

Micro Quad Small Form-Factor Pluggable (microQSFP) connector. Source: TE Connectivity Micro Quad Small Form-Factor Pluggable (microQSFP) connector. Source: TE Connectivity

TE is reportedly the first company to bring microQSFP products to market from the microQSFP Multi Source Agreement (MSA) group that is creating an industry-wide ecosystem for microQSFP, and ensuring that products can be easily adopted and integrated into existing data center designs.

MicroQSFP connectors deliver QSFP28 functionality in a smaller, generally SFP-sized form factor while providing significantly better thermal performance to help save energy costs, improved electrical performance at 25 gigabits per second (Gbps), and 33 percent higher density than QSFP to fit more ports on a standard line card.

The microQSFP connectors deliver 56Gbps performance with backward compatibility to 28 Gbps to support next generation designs. Built-in fins on TE’s new connectors eliminate the need for additional clips and heatsinks and allow faceplate airflow to the interior of the equipment, which helps microQSFP deliver significantly better thermal performance than QSFP28 and other leading solutions.



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