RSS
Supply Chain
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SEMI: Chip equipment billings rise in Q1
Overall billings reached $32.05 billion for the quarter.
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Qualcomm to acquire Alphawave Semi
The move will help expand the company’s reach into data centers.
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Integrated photonics set to disrupt traditional sensing tech
Advances in silicon photonics, AI and fiber optics are driving down costs and expanding applications for light-based sensors across medicine, infrastructure and autonomous systems.
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LG Innotek debuts 5G auto module with satellite link
It is being called a world’s first.
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Smiths Interconnect launches ‘DaVinci Gen V’ next-generation test socket
The product rigorously tests semiconductor chips during the manufacturing process to ensure they provide ultra-reliable and repeatable performance.
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Pfeiffer Vacuum+Fab Solutions introduces the CenterLine CNR series
These vacuum gauges are particularly suited for the harsh operating conditions in the semiconductor industry.
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Infineon and Typhoon HIL unveil plug-and-play EV test platform
The solution can be used to test motor drives, power electronics, on-board chargers and more.
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Micron debuts fast DRAM memory for AI gains, power savings
The memory will accelerate AI applications on smartphones.
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Asahi Kasei launches dry film for smarter chip packaging
The Sunfort series will enable fine wiring formation in panel-level packages and similar applications.
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Space chip revenue to nearly double by 2030
Satellites will continue to be the leading applications for these semiconductors.
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GF plans $16B reshoring effort to rebuild US chipmaking
New investments in New York and Vermont, partnering with tech giants and the Trump Administration to bring advanced chip production back to American soil.
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Report: Huawei assembles homegrown chip ecosystem amid US sanctions
More than 60 companies in the semiconductor supply chain have been invested in.
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The fallout of Wolfspeed’s potential bankruptcy
Renesas plans to exit the SiC market and leaves open-ended questions about investments and funding.
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Soitec, PSMC team on 3D chip stacking substrates
The new agreement brings TLT-ready 300 mm wafers to enable compact, energy-efficient 3D chip designs.
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Broadcom’s Tomahawk 6 breaks 100 Tbps barrier
Built for AI networks, it is being called a world’s first.
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Infineon debuts JANS-certified radiation-hardened GaN transistors
The series is targeted at space vehicles, probes and manned discovery.
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Renesas extends RZ/A MPU line-up with RZ/A3M for cost-sensitive, advanced HMI solutions
The microprocessor features large SDRAM, SRAM and RTOS support to facilitate the seamless execution of complex tasks and real-time graphical displays.
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IOTSWC 2025: IoT is here, working and scaling fast
The LoRaWAN Alliance’s takeaways from the 2025 IoT Solutions World Congress.
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ASIC packaging: How to navigate a complex and changing landscape
Why packaging should be equally as important to ASIC chips as the design flow.
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Engineering data communication inside Faraday cages
Inside TDK’s acoustic data link technology and where it might be used.
