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Supply Chain
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Digi-Key Electronics expands IoT portfolio
The distributor has signed a partnership with SG Wireless.
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Sensors: The eyes of aircraft automation
The extensive use of sensors permits aircraft to be nearly autonomous.
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Semiconductor refrigeration by laser
An infrared laser was used to cool a solid semiconductor optomechanical resonator by at least 20° C below room temperature.
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Watch the demo of a printed organic sensor smart mat for social distancing in retail settings
Embedded with 8,000 sensors, the smart distance-control floor mat helps to ensure social distancing in retail outlets.
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Nvidia and Mercedes-Benz team for self-driving cars
The automated driving system will be rolled out across the next generation of Mercedes-Benz cars beginning in 2024.
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New high isolation switch for 5G automotive applications
The switch is designed to support the ever-growing demand for cellular vehicle-to-everything connectivity.
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Globalfoundries purchases land to expand its manufacturing facilities
The land will help to expand semiconductor manufacturing in the U.S.
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New temperature sensor for automotive e-mobility applications
TDK has introduced the sensor for busbars, battery modules and connector systems.
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EU team demonstrates full data-transfer silicon photonics module delivering 100 Gb/s
The silicon-photonics-based transceiver multiplexes two wavelengths at 50 Gb/s and is designed to meet increasing data communication demands and energy use of data centers and supercomputers.
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Global chip production must switch to regional-based manufacturing to survive, study says
The impact of the COVID-19 pandemic has shown the flaw in having large production sites in a single location.
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Using wood to develop flexible electronic components
The technology could proliferate flexible wearables and help to eliminate electronic waste.
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CEA-Leti scientists demonstrate CMOS device fabrication at 500° C
Proof of integration of fully depleted silicon on insulator complementary metal–oxide–semiconductor (CMOS) devices processed at 500° C offers scope for further 3D monolithic integration.
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Paper chips pave the way to early forest fire alerts
Self-powered, green ionic-type thermoelectric paper chips were designed as sensors to quickly detect and transmit information about fire events.
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4 benefits to TSMC building a 5 nm fab in the US
The new 5 nm fab could support up to 20,000 wafers per month and will expand the domestic supply chain.
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First 24G SAS storage interoperability successfully tested
Microchip and Kioxia said the testing paves the way for broad industry deployment of the technology.
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SiC MOSFETs for main drive inverters of electric vehicles
Rohm has introduced its fourth generation of electronic components for the automotive market.
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Kopin’s imagers to be included in Goepel’s semiconductor test equipment
The inspection equipment will be used for measuring solder paste on PCBs in real time.
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Protecting embedded memory from external threats
Infineon has embedded security and safety functions into its NOR flash memory.
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NXP chooses TSMC’s 5 nm for new automotive platform
The company will build connected cockpits, self-driving cars, networking and propulsion control.
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New architecture for HPC devices uses gate-all-around nanosheet fabrication process
A new gate-all-around nanosheet device is deemed an alternative to fin field-effect transistor technology targeting high-performance (HPC) applications such as smartphones, laptops and mobile systems.
