Industrial Electronics

TDK presents embedded solutions for next generation applications at Embedded World 2026

06 March 2026

TDK Corporation announces its participation in Embedded World 2026, held from March 10 to March 12 in Nuremberg, Germany. At booth 505 in hall 1, TDK will showcase a wide range of embedded solutions designed to meet evolving application demands. Visitors can engage directly with TDK experts to learn more about current technologies and system-level approaches.

Source: TDK CorporationSource: TDK Corporation

Technology highlights include:

Sensor solutions: Sensing solutions for a variety of applications across internet of things (IoT), automotive, wearables, hearables, AR/VR, gaming, smart home and accessibility technology.

  • 2D/3D Hall-effect position sensors:
    Enable precise position detection of valves, flaps and actuators within the automotive thermal management system. They are robust against magnetic stray fields and provide accurate position information even in harsh automotive environments.
  • Temperature and pressure sensors:
    Provide accurate temperature and pressure measurement directly in fluid circuits such as oil, coolant and refrigerant lines. Designed for harsh automotive environments, these sensors combine fast response times, robust signal stability and easy integration to support efficient and reliable thermal management.
  • Digital MEMS microphones:
    Showcasing audio capture, acoustic activity detection and spoken keyword detection.
  • TMR and MEMS sensor fusion:
    Tracking everything every time, an absolute orientation detection for accurate heading and navigation, using on-chip system-level sensor fusion of 6-axis IMU (Inertial Measurement Unit) and 3-axis magnetometer.
  • Ultrasonic time-of-flight (ToF) sensor in iSee One smart glass:
    Thanks to its obstacle detection capabilities and ultra-low power consumption, the ultrasonic ToF enhances accessibility for individuals with visual impairments in an ergonomic design of a smart glass.

Embedded motor controllers: Fully integrated motor controllers for the drive of small DC motors (e.g., in automotive thermal management applications such as pumps, valves, grille shutters or fans).

  • Embedded gate driver and motor control ICs:
    Support efficient control of BLDC motors driving pumps and actuators in thermal management applications. Integrated control and communication functions enable compact system design and reliable motor operation.

Power supply solutions: Advanced AC-DC power supplies and DC-DC converters for cutting-edge industrial, medical and embedded applications.

  • RGC series: 300 W rated ruggedized non-isolated DC-DC buck-boost converters with an input voltage of 9 V to 53 V.
  • RGA series: 250 W rated ruggedized non-isolated DC-DC buck converters with an input voltage of 9 V to 40 V or 9 V to 53 V
  • CCG series: 6 W and 10 W rated DC-DC converters, suitable for through-hole or surface-mount placement.
  • i7A series: non-isolated DC-DC buck converters with the industry-standard 1/16th brick footprint.

Flash storage solutions: Solid state drives (SSDs) offering exceptional data reliability are ideal for applications like industrial equipment and edge computing, where stable operation is crucial.

  • SSDs featuring GBDriver series: moderately high-speed access and stable operation while securing data reliability.
  • DRAM-less SSDs with a power backup circuit: minimizing data errors, ideal solution for industrial embedded systems.

These flash‑storage technologies are already being integrated into European railway infrastructure and will be showcased at Embedded World together with their applications. The demonstration is presented in collaboration with IHI Corporation and features the “3D Laser Radar Level Crossing Obstacle Detection System.”

To contact the author of this article, email GlobalSpecEditors@globalspec.com


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