Source: TE/Mouser
Mouser Electronics now offers micro quad small form-factor (microQSFP) high-speed pluggable input/output (I/O) interconnects from TE Connectivity (TE).
TE’s microQSFP interconnects are next-generation microQSFP solutions designed to address key challenges relating to bandwidth, thermal performance and energy costs in data centers. TE’s microQSFP interconnects deliver QSFP28 functionality in a smaller form factor and provides higher density performance at 28 and 56 gigabits per second (Gbps). The pluggable I/O single high (1xN) cages and surface mount connectors are forged from traditional stainless steel and copper alloys. They also feature an integrated heatsink in a module that offers a thermal capability that can help reduce energy costs.
This interconnects solution has improved electrical performance at 25 Gbps and provides 33 percent higher density over QSFP connectors. It can fit up to 72 ports on a standard line card. The 4 x 28 Gbps solutions support next-generation designs with a smaller, standardized form factor and 25-Gbps, non-return to zero (NRZ)/56-Gbps pulse amplitude modulation (PAM)-4 performance with backward compatibility and 28 Gbps. TE’s microQSFP has been adopted as a media dependent interface (MDI) for the IEEE P802.3cd 50 Gbps project as supporting 50-Gbps (1 x 56 Gbps), 100-Gbps (2 x 56 Gbps) and 200-Gbps (4 x 56 Gbps) interfaces.
TE’s microQSFP interconnects offer a space-saving 14.25-millimeter port-to-port pitch and durability up to 1,000 cycles. Typical data communication applications for the microQSFP interconnect solution include networking switches, routers, servers, networking interface cards and optical transport equipment.
To learn more about this new release, visit Mouser.
