Connect with Samtec experts at the Optical Fiber Communication Conference and Exhibition (OFC) 2025, March 30 to April 3, 2025, at the Moscone Center in San Francisco, California. Samtec is pushing the envelope to deliver the best signal and power integrity performance, including optics, copper, connectors and cable solutions, whether a system operates at 56 Gbps, 112 Gbps or 224 Gbps.
Samtec Booth #5863
Left to right: Samtec Halo, FireBlade, ISI Board with BE90A Test Solutions Source: Samtec
Visit Samtec in Booth #5863. Featured products and technologies include:
Halo mid-board optical transceivers are designed for next-generation embedded applications demanding 56 or 112 Gbps PAM4 performance in low-profile and ruggedized form factors. New at OFC 2025 is the 112 Gbps PAM4 design.
Halo optical and Halo Cu copper systems are interchangeable using the same high-performance surface mount connector. They are available with up to 16 channels and 112 Gbps PAM4 performance per lane, are protocol agnostic, and boast a low 6.35 mm profile for space savings.
Samtec’s FireBlade FireFly OCP OAI EXP Module provides 1.6 Tbps aggregate throughput. The module supports Data Center, HPC and FPGA-to-FPGA protocols including Ethernet, InfiniBand, Fibre Channel, PCI Express and CXL.
Samtec’s ISI Evaluation Board offers numerous variable length signal paths with known loss profiles beyond 90 GHz. When combined with Samtec’s Bulls Eye High-Performance Test Systems, the solution provides an easy-to-use test platform for evaluating and demonstrating 224 Gbps PAM4/448 Gbps PAMx signal performance. Click here to learn more, or contact Samtec’s RF Group.
Si-Fly HD co-packaged and near-chip systems provide the highest-density 224 Gbps PAM4 solution in today’s market. Co-packaged offers the lowest loss signal transmission from the package to the front panel or backplane while providing the highest density. It’s PCIe 7.0 capable, and Samtec Eye Speed Hyper Low Skew Twinax cable technology supports 224G signaling with an industry leading 1.75 ps/m max intra-pair skew.
See cutting-edge co-packaged channels for both copper and optical cable systems. Co-packaged connectivity eliminates the insertion losses in the BGA breakout and the PCB. This technology makes a complete 224G passive DAC channel possible, enabling a low-power, cost-effective linear pluggable optics front panel solution with immense potential for connectivity in emerging artificial intelligence (AI) architectures.
OIF Booth #5745
Samtec will participate in the Optical Internetworking Forum (OIF) Interoperability demo at OFC 2025 in booth #5745. This demonstration will highlight advancements in interoperability tailored to address the growing demands of future-oriented data centers, AI/machine learning technologies and disaggregated systems.
Samtec products will also be included in CEI interoperability demonstrations, specifically the 224G long-range, 224G very short-range and 112G linear demos.
