Malaysian semiconductor assembly and test maker Unisem is expanding its microelectromechanical systems (MEMS) presence with additional factory space and assembly equipment.
The Kuala Lumpur–based company has recently completed the installation of a 1,200-square-meter class 100 clean room in its Chengdu, China, factory in order to support the assembly of MEMS microphones, combination cavity packages and other devices that need or will benefit from a controlled environment.
MEMS assembly being completed at Unisem’s factory in Chengdu, China. Source: Unisem The company also has invested in film-assisted molding capability to support the expansion of its MEMS-molded cavity packages. This molding allows Unisem to enter the automotive and industrial MEMS pressure sensor market as well as the consumer pressure, humidity, temperature and gas sensors market. Film-assisted molding provides for the use of leadframe-based packages and molding the sensor device itself, leaving only the sensing area exposed in the cavity, according to Unisem.
Unisem says it has recently completed the shipment of its one billionth packaged MEMS device and believes that in the next 12 months, it will grow its MEMS unit volume by 50% with this additional investment in the technology.
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