Industrial Electronics

Teardown: Kyocera KYM11 M2M Module

22 May 2015
The following is an overview of a teardown analysis conducted by IHS Benchmarking.

Kyocera’s KYM11 M2M module is a multi-band cellular communications device for machine-to-machine (M2M) applications across a wide spectrum of industries.

“With this module, Kyocera is clearly trying to capitalize on the growing use of cellular M2M technology in a wide range of vertical markets such as automotive, security and healthcare," says Josh Builta, IHS senior analyst for M2M. "Though the integration of LTE technology adds significantly to the overall module cost, it also makes this device ideal for M2M applications that require high throughput speeds, such as video surveillance and automotive infotainment systems.

Teardown summary points:

  • 4G LTE M2M Module
  • Features Qualcomm MDM9310 Chipset
  • Made in Japan

Target market: Various – Automotive, Healthcare, Industrial

Pricing: N/A

Availability: Global (assumed)

Total cost (direct materials and manufacturing): $39.64

Major Components:

- Baseband Processor, Multi-mode, Multi-band – MFG: QUALCOMM – MPN:MDM9310 – (Qty: 1)

- MCP, 4 Gb NAND Flash + 4 Gb Mobile DDR – MFG: MICRON TECHNOLOGY INC – MPN: MT29C4G48MAAGBAAKS-5 WT – (Qty: 1)

- RF Transceiver, Multi-mode, Multi-band, GSM/EDGE/HSPA+/CDMA EVDO Rev. B/TD-SCDMA/LTE, GPS/GLONASS, 65 nm – MFG: QUALCOMM – MPN: WTR1605L – (Qty: 1)

- Audio CODEC, 7 Analog Inputs, 8 Analog Outputs, 7 ADCs, 8 DACs, 6 Digital Microphone Inputs, 65 nm - – MFG: QUALCOMM – MPN: WCD9310 – (Qty:1)

- Power Management IC – MFG: QUALCOMM – MPN: PM8018 – (Qty: 1)

- Machine Identification Module – MFG: INFINEON TECHNOLOGIES AG – (Qty: 1)

- Bus Transceiver, 8-bit, Dual Supply, w/ 3-state Outputs – MFG: NXP SEMICONDUCTORS – MPN: 74LVC8T245BQ – (Qty: 3)

- 8-layer, FR4, Lead-free, 2+4+2 – (Qty: 1)


- Duplexer, LTE Band 18, 822.5/867.5 MHz – MFG: MURATA MANUFACTURING CO LTD – MPN: SAYFH822MCA0F0A – (Qty: 1)

Main PCB (Source:IHS)Main PCB (Source:IHS)

Device Overview (Source: IHS)Device Overview (Source: IHS)

Main PCB Top (Source: IHS)Main PCB Top (Source: IHS)

Main PCB Bottom (Source: IHS)Main PCB Bottom (Source: IHS)

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