Texas Instruments (TI) unveiled at the Applied Power Electronics Conference (APEC) 2026 isolated power modules that allow for increased power density, efficiency and safety in data centers, electric vehicles and more.
The UCC34141-Q1 and UCC33420 isolated power modules use TI’s IsoShield technology — a multichip packaging solution that features a claimed three times higher power density than discrete solutions in isolated power designs, TI said.
“Packaging innovation is revolutionizing the power industry, with power modules at the forefront of this transformation,” said Kannan Soundarapandian, VP and GM of high voltage products at TI.
Power modules traditionally conserve board space and advancements in packaging further enhance performance and efficiency gains, TI said.
The IsoShield technology co-packages a planar transformer and an isolated power stage to offer basic and reinforced isolation capabilities. The technology enables a distributed power architecture for safety requirements by avoiding single-point failures.
TI said the packaging shrinks the module size by as much as 70% while delivering up to 2 watts of power that could be used in automotive, industrial and data center applications.
Why it matters
TI said power density is becoming a critical part of data center and automotive designs. As more data centers are built to meet growing demand, power modules must pack more power in smaller spaces, the company added.
This means more higher power density components in compact form factors for data centers.
Additionally, the increased power density enabled by the IsoShield technology helps to engineer light and more efficient EVs that can expand the range of these vehicles.
