Power

APEC 2019: GaN Systems to present on gallium nitride-optimized solutions

04 March 2019

Gallium nitride (GaN) has reached prime-time status as evident in the presentations, displays and demonstrations to be presented by GaN Systems and its customers and partners at the upcoming APEC Source: GaN Systems Source: GaN Systems conference in Anaheim, California, March 17 to 21.

An APEC Industry Session presentation addressing “GaN E-HEMT Performance and Reliability in Datacenter, Solar and Wireless Power Production Systems,” is scheduled for March 21. In this session, GaN Systems CEO Jim Witham and executives from relevant companies will describe the importance of using GaN power semiconductors in their applications:

  • Denso, a participant in the automotive market, will speak about the paradigm shift happening in the transportation market and how smaller and lighter electronics using wide-bandgap materials like GaN enable smaller and lighter electric vehicles.
  • Sonnen, a behind-the-meter energy storage solution provider, will describe the challenges they faced in creating their next0generation products and the improvements made by GaN, including decreasing the bill of materials (BoM) cost.
  • Supermicro, a developer of high-performance, high-efficiency server technology and innovation, will explain how increasing data center efficiency is reducing Total Cost to the Environment (TCE) and Total Cost of Ownership (TCO) of data centers.

In addition to this panel session, GaN Systems’ experts will be presenting in several industry sessions: Devices and Controllers in Adapter Application, Vehicle Electrification, and Wireless, as well as participating in two rap sessions.

Customer demonstrations

GaN Systems will also be showcasing new devices and technologies from customers and partners in booth 553 highlighting how power system designs using GaN are meeting size, power, efficiency and system cost requirements.

For more on APEC, visit our dedicated section Electronics360 covers APEC 2019.

To contact the author of this article, email engineering360editors@globalspec.com


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