As power density, efficiency and integration challenges accelerate across artificial intelligence (AI) infrastructure, optical interconnects, renewable energy and automotive platforms, system level thinking is no longer optional.
At APEC 2026, Murata will demonstrate how advanced packaging and chiplet technologies connect seamlessly into complete power architectures — supported by real world system block diagrams across key applications.
Source: Murata
Explore Murata solutions across key applications:
Automotive power and electronics
• On board chargers and DC DC converters for electric vehicle and hybrid platforms
• In vehicle infotainment and AD/ADAS ECUs
• Power solutions for lidar, radar and front camera systems
AI and compute infrastructure
• Power architectures for motherboards, AI accelerators and optical transceivers
• High efficiency, high density solutions for advanced computing platforms
Energy and industrial systems
• Power solutions for PV inverters and energy conversion systems
• Designed for reliability and efficiency in harsh operating environments
Why visit Murata at APEC?
• Application level demonstrations — not just components
• Insight into power density, efficiency and thermal trade offs
• Proven solutions designed for scalability and reliability
• Design simplification by advanced packaging and chiplet integration
Event details:
Henry B. Gonzalez Convention Center San Antonio, Texas
March 22 to March 26, 2026
Murata Booth #833
