Wired Connectivity

Intel Accelerates China’s Move to 5G

25 September 2018

Intel announced 5G moves it is participating in at this week's 5G Network Summit. Source: IntelIntel announced 5G moves it is participating in at this week's 5G Network Summit. Source: IntelThe race to 5G is accelerating. Multiple new projects are springing up alongside further deployments and movement across the communications value chain.

China is moving quickly with its 5G deployment and investment, so much so that the country is at the forefront of adoption, well ahead of other countries.

Intel Corp. recently unveiled new developments across the 5G value chain with Chinese leaders including Baidu, China Mobile, China Telecom, China Unicom, H3C, Huawei, Tencent, Unisoc and ZTE.

Intel is also collaborating with SiTime for silicon timing solutions and this week rolled out a 100 G silicon photonics transceiver.

Some of the recent developments in the value chain Intel announced at this week’s 5G Network Summit in Beijing including:

  • Unisoc is using Intel 5G modems for mid-tier Android smartphones in China and globally with its applications processor, ROC1.
  • Baidu is forming a joint artificial intelligence and 5G innovation lab to explore edge and cloud services for 5G-ready applications such as the IoT, entertainment and automotive.
  • China Unicom plans to collaborate with Intel on 5G experiences at the upcoming 2022 Winter Olympics.
  • Alibaba has named Intel as a strategic partner in intelligent transportation initiative for the construction of an intelligent road traffic network.
  • H3C plans to use an Intel FlexRAN 5G NR-compliant solution for 5G.
  • Huawei has successfully test interoperability trials with Intel as part of the IMT 2020 5G Phase 3 testing. The companies will work on driving the International Telecommunications Union (ITU) standard.
  • Tencent is deploying a cloud gaming platform based on Intel’s Xeon processors that will focus on infrastructure, game R&D, distribution and devices.
To contact the author of this article, email PBrown@globalspec.com


Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the GlobalSpec
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Advertisement
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter
Advertisement