Wired Connectivity

Intel Pushes 5G Technology with SiTime MEMS Collaboration

24 July 2018

SiTime's MEMS timing device. Source: SiTimeSiTime's MEMS timing device. Source: SiTimeIntel Corp. has formed a partnership with microelectromechanical systems (MEMS) provider SiTime Corp. to integrate timing solutions to its 5G multi-mode radio modems.

The collaboration includes Intel using SiTime’s MEMS-based silicon timing solutions to help Intel 5G customers build platforms that increase performance and capacity. The collaboration will allow the modem technology to be used in mobile and consumer 5G devices as well as enterprise and industrial use cases, Intel said.

The MEMS timing solutions enhance system performance in the presence of stressors such as vibration, high temperature and rapid thermal transients. These stresses can disrupt timing signal and result in network reliability issues, lower data throughput and connectivity drops. SiTime said the MEMS technology helps meet the performance requirements for emerging 5G radio modem platforms.

"Intel is already building 5G's future and has the scale to meet 5G's scope," said Rajesh Vashist, CEO at SiTime. "Our collaboration enables SiTime to align our MEMS timing solutions roadmap with Intel's 5G platforms.”

SiTime said 5G will transform society by enabling smart cities, intelligent wind farms, the future of the internet of things (IoT) and connected infrastructure generating zettabytes of data from 50 billion devices.

Because systems will be deployed closer to connected devices and in uncontrolled locations such as streetlamps, traffic lights, rooftops, stadiums and parking garages, 5G devices will be subject to environmental stresses that will require these devices to be robust, reliable and still capable of performing effectively. SiTime claims its MEMS timing solutions are 20 times better than competing devices at dealing with these potential stressors.

To contact the author of this article, email PBrown@globalspec.com


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