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Intel and Baidu collaborate on 5G, AI and cloud computing

16 September 2020

Intel and Baidu are collaborating on several emerging technologies such as artificial intelligence (AI), 5G, data center and cloud computing infrastructure.

The goal of the collaboration is to seize opportunities in the AI industry and bring more value to the industry, society and individuals.

"In China, the most important thing for developing an industry ecosystem is to truly take root in the local market and its users' needs,” said Rui Wang, vice president of sales and marketing at Intel. “With the full-speed development of 'new infrastructure' and 5G, China has entered the stage of accelerated development of the industrial internet. Intel and Baidu will collaborate comprehensively to create infinite possibilities for the future through continuous innovation, so that technology can enrich the lives of everyone."

Intel and Baidu are focusing on AI in the cloud for autonomous driving, 5G and cloud services using Intel Xeon Scalable processors for optimized performance, thermal design power (TDP), temperature and feature sets in Baidu’s cloud infrastructure. Intel’s Xeon processors include built-in BFloat16 instruction set and support Baidu’s optimization of the PaddlePaddle framework for enhanced speech prediction services and multimedia processing.

The companies are also collaborating on next generation 48 V rack servers based on the Xeon Scalable processors for power density, reduced power consumption and improved energy efficiency. The goal is to increase the maturity of 48 V and promote the adoption of 48 V in the future.

Other collaborations include networking with the development of smart network interface card (NIC) innovations based on Intel’s field programmable gate arrays (FPGAs) and Intel Ethernet 800 series adapter with application device queues (ADQ) technology. In terms of 5G, the companies will work on capabilities of the open network edge services software (OpenNESS) toolkit and the Baidu intelligent mobile edge (IME) for edge compute solutions with AI capabilities for low-latency applications.

Future collaborations may include working on autonomous vehicle architecture platform and intelligent transportation vehicle-road computing architecture as well as mobile edge computing and smart cloud infrastructure technology.

To contact the author of this article, email PBrown@globalspec.com


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