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Beset by Ails, Mobile DRAM Underperforms in Q1
Laboring under the combined weight of a seasonal slump and sharply lower average selling prices, the market for mobile dynamic random access memory (DRAM) posted lackluster...
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Thinner Hard Disk Drives with Rapidly Growing Shipments to Present New Opportunities
Newly released thinner hard disk drives (HDD) sized 5.0 and 7.0 millimeters have the potential to gain back some HDD market share lost to solid-state drives (SSD), especially...
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Toshiba to Expand Leading-Edge NAND Flash Fab
Toshiba plans to enlarge its state-of-art No. 5 semiconductor fab where it will build NAND flash memory on next-generation process technology.
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UMC Expands Foundry Deals with IBM, Kilopass
UMC joins the IBM Technology Development Alliances as a participant in the group’s development of 10nm CMOS process technology.
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Dialog Semi to Buy iWatt to Expand in Mobile and Solid State Lighting
German-based Dialog Semiconductor has entered into an agreement to acquire iWatt, a leading provider of digital power management chips, for approximately $310 million.
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US Manufacturing Rebounds in June, Electronics Still “Under Pressure”
Following a slowdown in activity in May, the U.S. manufacturing sector rebounded in June and is back on a positive growth path, according to the ISM.
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Component Suppliers Struggle with Soft Recovery
While all leading indicators are pointing to the return of seasonal growth in the second half of 2013, the electronic component industry including semiconductors is currently...
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Alcatel Lucent 7705 SAR-M Service Aggregation Router Teardown
1U Rack Mount 'Service Aggregation Router'; Provides multiservice adaptation, aggregation and routing for Ethernet and IP/MPLS network.
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Cisco ASR 901-12C-FT-D Aggregation Service Router Teardown
1U Rack Mount 'Aggregation Services Router'; Configuration includes: Chassis, Ethernet and TDM interfaces, DC power
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Dell Wyse Z90D7 (8GF/4GR) Thin Client Teardown
CPU: AMD T56N Series, Dual-Core 1.65GHz, 512KB L2 Cache, w/ Integrated Radeon HD6320 GPU
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Grandstream GXP1450 Enterprise IP Phone Teardown
Entry-level desktop SIP phone3.2' 180x60 pixel backlit graphical monochrome LCDDual switched auto-sensing 10/100Mbps network ports with integrated PoEFull-duplex speakerphoneTarget MarketSmall business / EnterpriseReleasedDec 2010 per press releasePricing
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Grandstream GXP2200 Enterprise IP Phone Teardown
Mid-to-high range desktop SIP phone running on Android platform; 4.3' 480x272 pixel capacitive touchscreen color TFT LCD
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HP t610 (B8C95AA#ABA) Flexible Thin Client Teardown
CPU: AMD T56N Series, Dual-Core 1.65GHz, 512KB L2 Cache, w/ Integrated Radeon HD6320 GPUChipset: AMD A55E Series, 4 PCI Express 2.0, 6 SATA 3.0, 14-Port USB 2.0 & 2-Port USB 1.1Memory: 2 x SK Hynix 2GB DDR3-1600 SO-DIMMStorage: Apacer 16GB MLC NAND SATA2 S
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Intel Server System H2216JFQKR Teardown
2U Rack for High Performance Computing
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Intel Server System P4308CP4MHGC Teardown
4U Pedestal for Small and Medium Business
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Juniper Networks ACX2000 Universal Access Router Teardown
1U Rack mount unit - 'Universal Access Router'; Fan-less passive cooling; 16 TDM (T1/E1), 8 copper GbE (with PoE), two GbE SFP ports, two 10 GbE SFP+ ports.
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MIT Researchers Make Progress in Terahertz Electro-Optics
MIT researchers have proposed combining ferroelectric materials with graphene that could lead to denser computer and memory chips, and consume less power than today’s chips.
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Orders Up, Shipments Down for Printed Circuit Boards in May
North American PCB shipments declined 4.4 percent in May compared to May 2012, but bookings increased 8.3 percent, according to IPC.
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SIA Reports Global Chip Sales Up in May
Global sales of semiconductors increased 4.6% in May from April, according to the SIA, which was the largest sequential monthly increase for the industry since March 2010.
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Projected Capacitive Touch-Controller ICs, Used for Touch-Screen Devices, Set to Enjoy Buoyant Growth
The market for projected capacitive (PCAP) touch-controller ICs that make touch-screen functionality possible will experience healthy growth this year and beyond because of...
