Intel Server System H2216JFQKR Teardown

Summary Points

2U Rack

High Performance Computing

Released

Q3 2012

Intel Server System H2216JFQKR - Motherboard Top

$6766 USD On Arrow Website

Global Assumed

Volume Estimations

6,000 Annual Production Volume
1 Product Lifetime (Years)

For the purposes of this teardown analysis, we have assumed an Annual Production Volume of 6000 units and a Product Lifetime Volume of 1 year(s).

Teardown volume and production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.

Intel Server System H2216JFQKR Cost Analysis

Total BOM: $1,832.67
Top Cost Drivers below: $1,765.88
% of Total BOM 96%

Main Cost Drivers below

Node Assembly- (Qty: 4)
Delta Electronics - DPS-1200TB - Switching Power Supply - Redundant, 1200W Max, 100-127V/200-240V & 12.32A/7.16A Input, 12V/83A & 12Vsb/3A OR 12V/100A & 12Vsb/3A Output, 80 PLUS Platinum, 93.32% Average Efficiency- (Qty: 2)
Enclosure, Main, Chassis - 6 Pieces Stamped / Formed Electro-Galvanized Steel, 8 Pieces Stamped / Formed Spring Steel, w/ 18 Pressed-In Metal Pins, 4 Pressed-In Threaded Metal Inserts, 12 Rivets, and 90 Clinch Points- (Qty: 1)
Gold Circuit Electronics - 10-Layer - FR4, Lead Free- (Qty: 2)
HDD Side Rail A - Die-Cast Aluminum- (Qty: 16)
HDD Side Rail B - Die-Cast Aluminum- (Qty: 16)
Enclosure, Main, Drive Bay - 8 Pieces, Stamped / Formed Electro-Galvanized Steel, Painted, w/ 32 Clinch Points- (Qty: 1)
Enclosure, Main, Top - 2 Pieces, Stamped / Formed Electro-Galvanized Steel, w/ 4 Clinch Points- (Qty: 1)
Samtec - HSEC8-140-01-L-DV-A - Card Edge - Vertical, w/ Gold Plated Contacts- (Qty: 5)
Wire Harness - 18 18AWG Discrete Insulated Wires, w/ 2 18-Position Locking Dual Row Pin Socket Connectors, 3 Zip Ties, and Label- (Qty: 4)

Not Included in Analysis

The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.

We do provide an Excel tab 'Overall Costs' where a user can enter their known pre and post production costs to build a per unit cost reflective of theirs actual expenditures.

Country of Origin

For the purposes of this analysis, we are assuming the following country(ies) of origin for each level of assembly, based on a combination of 'Made In' markings, and/or assumptions based on our knowledge of such equipment.

Backplane PCB - China
Front Interface PCB A - China
Front Interface PCB B - China
Node Assembly - China
Other - Enclosures / Final Assembly - China
Power Supply PCB A - China
Power Supply PCB B - China

Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as combo modules), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.

Labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. "Auto inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.

Design Complexity

Component counts by assembly and the number of assembly are indicators of design complexity and efficiency.

Component Qty: 3786 - Node Assembly
Component Qty: 350 - Other - Enclosures / Final Assembly
Component Qty: 685 - Backplane PCB
Component Qty: 10 - Power Supply PCB B
Component Qty: 10 - Power Supply PCB A
Component Qty: 60 - Front Interface PCB A
Component Qty: 60 - Front Interface PCB B
Component Qty: 4961 - Grand Total

Intel Server System H2216JFQKR - Disassembly View 1