Computer Electronics

Dell Wyse Z90D7 (8GF/4GR) Thin Client Teardown

01 July 2013
The following is an overview of a teardown analysis conducted by IHS Benchmarking.

Summary Points

  • CPU: AMD T56N Series, Dual-Core 1.65GHz, 512KB L2 Cache, w/ Integrated Radeon HD6320 GPU
  • Chipset: AMD A55E Series, 4 PCI Express 2.0, 6 SATA 3.0, 14-Port USB 2.0 & 2-Port USB 1.1
  • Memory: 1 x Apacer 4GB DDR3-1333 DIMM
  • Storage: Apacer 8GB SLC NAND SATA2 SSD
  • OS: Windows Embedded Standard 7

Target Market


Dell Wyse Z90D7 (8GF/4GR) Thin Client Main ImageDell Wyse Z90D7 (8GF/4GR) Thin Client Main Image


Q1 2012

Pricing and Availability

950 USD

Lowest e-tailer price found at the time of this analysis (April, 2013) is $745

N. America / Europe

Dell Wyse Z90D7 (8GF/4GR) Thin Client - Motherboard TopDell Wyse Z90D7 (8GF/4GR) Thin Client - Motherboard Top

Volume Estimations

1,200,000 Annual Production Volume
3 Product Lifetime (Years)

For the purposes of this teardown analysis, we have assumed an Annual Production Volume of 1200000 units and a Product Lifetime Volume of 3 year(s).

Teardown volume and production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.

Dell Wyse Z90D7 (8GF/4GR) Thin Client Cost AnalysisDell Wyse Z90D7 (8GF/4GR) Thin Client Cost Analysis

Cost Notes

Total BOM: $192.18
Top Cost Drivers below: $152.67
% of Total BOM 79%

Main Cost Drivers below

Apacer - APSDM008G4LASS-KT - SSD - 8GB, SLC, SATA 1.5Gbps- (Qty: 1)
AMD - GET56NGBB22GVE - CPU - AMD G-Series T56N APU, Dual-Core, 1.65GHz, 512KB L2 Cache, w/ Integrated AMD Radeon HD6320 GPU- (Qty: 1)
Apacer - AP4096-DDR310600 - DIMM DDR3-1333 - 4GB, 256Mx128, 1.5V, Contain 16 SK Hynix H5TQ2G83CFR-H9C Memory Ics, w/ Label- (Qty: 1)
AMD - 100-CG2293 - Platform Controller Hub - AMD A55E Chipset, 4-Channel PCI Express 2.0, 6-Channel SATA 3.0, 14-Port USB 2.0 & 2-Port USB 1.1- (Qty: 1)
Tripod Technology - 6-Layer - FR4, Lead Free, Halogen Free- (Qty: 1)
Chicony Electronics - KU-8933 - Keyboard - 104 Keys, w/ 6ft Cord, USB Plug & PS/2 Socket- (Qty: 1)
Asian Power Devices - NB-65B19 - AC Adapter - 19V, 3.42A, 65W, w/ 6ft Cord- (Qty: 1)
Cooler Assembly - Stamped / Formed Metal Mounting Bracket, Copper Tube, Aluminum Fins, Plastic Insulator, w/ 6 Spring-Loaded Mounting Screws & Thermal Transfer Material- (Qty: 1)
WYSE - MO42KOP - Optical Mouse - w/ 6ft Cord & PS/2 Plug- (Qty: 1)
Enclosure / Cage - 2-Pieces, Stamped / Formed Electro-Galvanized Steel & Stainless Steel, Painted, w/ 7 Pressed-In Threaded Inserts & 5 Spot Welded Points- (Qty: 1)

Dell Wyse Z90D7 (8GF/4GR) Thin Client - Motherboard BottomDell Wyse Z90D7 (8GF/4GR) Thin Client - Motherboard Bottom

Not Included in Analysis

The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.

We do provide an Excel tab 'Overall Costs' where a user can enter their known pre and post production costs to build a per unit cost reflective of theirs actual expenditures.

Country of Origin

For the purposes of this analysis, we are assuming the following country(ies) of origin for each level of assembly, based on a combination of 'Made In' markings, and/or assumptions based on our knowledge of such equipment.

Box Contents - China
Motherboard - China
Other - Enclosures / Final Assembly - China
Storage Device - China

Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as combo modules), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.

Labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. "Auto inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.

Dell Wyse Z90D7 (8GF/4GR) Thin Client - Disassembly View 1Dell Wyse Z90D7 (8GF/4GR) Thin Client - Disassembly View 1

Design Complexity

Component counts by assembly and the number of assembly are indicators of design complexity and efficiency.

Component Qty: 1147 - Motherboard
Component Qty: 60 - Storage Device
Component Qty: 34 - Box Contents
Component Qty: 63 - Other - Enclosures / Final Assembly
Component Qty: 1304 - Grand Total

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