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Texas Instruments introduces 6 power modules
The devices use TI’s MagPack integrated magnetic packaging technology.
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An introduction to nanophotonic sensors
These sensors utilize the interactions between light and matter to detect physical, chemical or biological occurrences at extremely small scales.
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Celebrate excellence: 2025 SPIE Prism Awards open for outstanding photonics products
The most innovative optics and photonics products on the market will be recognized in January 2025.
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Buck converters: Operating principles and applications
Buck converters convert a higher voltage to a lower voltage while increasing the current.
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Video: Arizona is home to more than 40 chip investments
At SEMICON West 2024, the state touts its semiconductor prowess.
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Littelfuse adds ITV2718 5-amp rated battery protector series to prevent Li-ion battery pack damage
Inclusion of these fuses safeguards lithium (Li)-ion battery packs against overcurrent and overcharging (overvoltage) conditions — even when fast charging.
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Murata launches combo LoRa/GNSS module
The LPWAN device features Semtech’s LoRa edge LR1110 transceiver IC and RF components.
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SEMICON West 2024: New burn-in capability on AEM’s test platform
The tool is used to perform high voltage stress testing for AI processors and computing units.
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First 6G research facility launched in UK
The National 6G Radio Systems Facility will be located at the University of Sheffield.
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BP expands EV charging network in US
The oil giant signs a deal with Simon for 900 ultra-fast charging bays across the nation.
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Melexis opens its largest wafer testing site in Malaysia
The facility is designed to meet increased demand for semiconductors in the region.
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Is generative AI spending slowing?
A new study finds only 58% of technology vendors plan to increase spending this year, down sharply from 2023.
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Nexperia’s 650 V ultra- and hyperfast recovery rectifiers in D2PAK Real-2-Pin packaging offer high efficiency and reliability
The package configuration allows rectifiers to comply with higher creepage and clearance standards.
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43 billion MEMS units shipped by 2029
Revenues will reach $20 billion by this same timeframe.
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SEMICON West 2024: Nearfield Instruments’ Quadra system has a new ‘Lightning Mode’
The AFM metrology system is now qualified for high-volume manufacturing.
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SEMICON West 2024: Applied Materials rolls new technologies for 2 nm node
The materials are designed to increase the performance-per-watt of computer systems by enabling copper wire to scale to low logic nodes.
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Smart magnetics innovation by Exxelia: Enhancing next-generation resonant and bidirectional power converters
These advancements are set to redefine efficiency and performance standards across a spectrum of applications.
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$1.6 billion in R&D funding open for competition
Through the CHIPS Act, investments will be given to five different technology sectors.
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ASRock Industrial unveils new industrial motherboards with embedded processors to power advanced edge AI applications
These cutting-edge motherboards are meticulously designed to meet the demands of modern edge applications, providing unparalleled performance and robust connectivity.
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SEMICON West 2024: Chip equipment sales to set new record in 2024
SEMI forecasts the sector reaching $109 billion.
